Article (Scientific journals)
Preparation and characterization of a thermal insulating carbon xerogel-epoxy composite adhesive for electronics applications
Fagnard, Jean-François; Stoukatch, Serguei; Laurent, Philippe et al.
2021In IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (4), p. 606-615
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Keywords :
Thermal conductivity;Conductivity;Electronic packaging thermal management;Carbon;Thermal management;Temperature measurement;Heat sinks;Composite materials;microassembly;microsensors;microsystems;thermal conductivity measurements
Abstract :
[en] In some specific microelectronic applications, there is a demand for adhesive materials (glues / encapsulants) having very good thermal insulation properties. We have studied the properties obtained on epoxy-based samples loaded by several levels of xerogel filling. The thermal conductivity of these materials depends on the exact chemical composition and their manufacturing process. As a result, the thermal conductivity given in the manufacturer’s specifications or in the literature generally exhibits some dispersion. Therefore, we have developed a straightforward experimental rig, based on a vacuum chamber and miniature Pt100 sensors measurements, to precisely know the thermal conductivity of the various insulating materials used in the development and the assembly of select microsensors and microsystems. The results showed a decrease in the thermal conductivity of our xerogel-epoxy composites up to 35.8% compared to the value of the unfilled epoxy, corresponding to a thermal conductivity value of 107.9 mW m-1 K-1. In addition, cross-sectional images were observed by optical microscopy to characterize the specific microstructure of each sample in order to relate these observations to improvements in thermal conductivity.
Disciplines :
Materials science & engineering
Chemical engineering
Author, co-author :
Fagnard, Jean-François  ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Stoukatch, Serguei  ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Laurent, Philippe ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Dupont, François ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Wolfs, Cédric ;  Université de Liège - ULiège > Department of Chemical Engineering > Nanomaterials, Catalysis, Electrochemistry
Lambert, Stéphanie  ;  Université de Liège - ULiège > Department of Chemical Engineering > Nanomaterials, Catalysis, Electrochemistry
Redouté, Jean-Michel  ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Language :
English
Title :
Preparation and characterization of a thermal insulating carbon xerogel-epoxy composite adhesive for electronics applications
Publication date :
April 2021
Journal title :
IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN :
2156-3950
eISSN :
2156-3985
Publisher :
Institute of Electrical and Electronics Engineers, Piscataway, United States - New Jersey
Volume :
11
Issue :
4
Pages :
606-615
Peer reviewed :
Peer Reviewed verified by ORBi
Name of the research project :
Micro+
Funders :
Région wallonne [BE]
FEDER - Fonds Européen de Développement Régional [BE]
Available on ORBi :
since 17 February 2021

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