Boltshauser T., Schonholzer M., Brand O., Baltes H. Resonant humidity sensors using industrial CMOS-technology combined with postprocessing. Journal of Micromechanics and Microengineering 1992, 2:205-207.
Geen J.A., Sherman S.J., Chang J.F., Lewis S.R. Single-chip surface micromachined integrated gyroscope with 50/spl deg//h Allan deviation. IEEE Journal of Solid-State Circuits 2002, 37:1860-1866.
Greenwood J., Wray T. High accuracy pressure measurement with a silicon resonant sensor. Sensors and Actuators A: Physical 1993, 37:82-85.
Ikeda K., Kuwayama H., Kobayashi T., Watanabe T., Nishikawa T., Yoshida T., Harada K. Silicon pressure sensor integrates resonant strain gauge on diaphragm. Sensors and Actuators A: Physical 1990, 21:146-150.
Kazemnia K.E., Hosseini S.M., Tahani M. An analytical solution for thermoelastic damping in a micro-beam based on generalized theory of thermoelasticity and modified couple stress theory. Applied Mathematical Modelling 2016, 40:3164-3174.
Kempe V. Inertial MEMS: Principles and Practice 2011, Cambridge University Press, New York.
Kinnell P.K., Craddock R. Advances in silicon resonant pressure transducers. Procedia Chemistry 2009, 1:104-107.
Lifshtz R., Roukes M.L. Thermoelastic damping in micro-and nanomechanical systems. Physical Review B 2000, 61:5600-5609.
Lobontiu N. Dynamics of Microelectromechanical Systems 2007, Springer Science, New York.
Lobontiu N., Garcia E. Mechanics of Microelectromechanical Systems 2004, Cornell University, Ithaca, NY.
Pandey A.K., Pratap R. A comparative study of analytical squeeze film damping models in rigid rectangular perforated MEMS structures with experimental results. Microfluidics and Nanofluidics 2008, 4:205-218.
Pustan M., Rymuza Z. Mechanical properties of flexible microcomponents with movable load. Journal of Micromechanics and Microengineering 2007, 17:1611-1617.
Pustan M., Birleanu C., Dudescu C. Simulation and experimental analysis of thermo-mechanical behavior of microresonators under dynamic loading. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2012), Cannes, France, 25-27 April 2012, 87-92 2012.
Pustan M., Birleanu C., Rusu F., Dudescu C., Belcin O. Size effect on the microbridges quality factor tested in free air space. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiment in Microelectronics and Microsystems (EUROSIME 2014), Ghent, Belgium, 07-09 April 2014 2014.
Pustan M., Dudescu C., Birleanu C. Reliability design based on experimental investigations of paddle MEMS cantilevers used in mass sensing applications. Sensor Letters 2014, 12:1600-1606.
Sun Y., Fang D., Soh A.K. Thermoelastic damping in micro-beam resonators. International Journal of Solids and Structures 2006, 43:3213-3229.
Yi Y.B. Geometrical effects on thermoelastic damping in MEMS resonators. Journal of Sound and Vibration 2008, 309:588-599.
Zener C. Internal friction in solids. Theory of internal friction in reeds. Physical Review 1937, 32:230-235.
