Evaluation of aerosol jet printing (AJP) technology for electronic packaging and interconnect technique

We evaluated AJP (Aerosol Jet Printing) deposited silver layer on variety of organic substrates for the most common interconnect techniques for electronic packaging. Specifically, we checked if the AJP silver layer can be electrically interconnected by Au and Al wires bonding technique. We also evaluated suitability of AJP silver layer for surface-mount technology (SMT). We performed electrical characterization of the AJP silver layer.