Paper published in a book (Scientific congresses and symposiums)
Finite element modelling of electrostatic MEMS including the impact of fringing field effects on forces
Boutaayamou, Mohamed; Nair, Harish; V Sabariego, Ruthet al.
2006 • In Proceedings of the 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE2006)
electrostatic actuators, electrostatics, finite element analysis
Abstract :
[en] The numerical models describing the behaviour of electrostatically actuated microsystems often disregard fringing fields. However, taking the fringing fields into account is crucial for an accurate computation of the electrostatic forces. In this work, the finite element method is applied for modeling electrostatic actuators. The electrostatic force distribution is obtained by locally applying the virtual work method. A micro-beam and a comb drive are considered as test cases. The impact of the fringing field effects on the accuracy of electrostatic forces is shown through 2D and 3D parametric studies.
Disciplines :
Electrical & electronics engineering
Author, co-author :
Boutaayamou, Mohamed ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Capteurs et systèmes de mesures électriques
Nair, Harish
V Sabariego, Ruth ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Applied and Computational Electromagnetics (ACE)
Dular, Patrick ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Applied and Computational Electromagnetics (ACE)
Language :
English
Title :
Finite element modelling of electrostatic MEMS including the impact of fringing field effects on forces
Publication date :
2006
Event name :
7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE2006)
Event date :
24-26 April 2006
Audience :
International
Main work title :
Proceedings of the 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE2006)
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