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Modeling and Finite Element Analysis of Mechanical Behavior of Flexible MEMS Components
Pustan, Marius; Paquay, Stéphane; Rochus, Véronique et al.
2010In Courtois, Bernard (Ed.) DTIP 2010
 

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Keywords :
Flexible microcomponents; Multilayer structures; Stress and Strain
Abstract :
[en] This paper describes the studies of the mechanical characteristics of flexible MEMS components including theoretical approach, finite element analysis and experimental investigations. Modeling and finite element analyses together with theoretical and experimental investigations are performed to estimate the mechanical behaviour of MEMS components as microcantilevers, microbridges and micromembranes. The finite element analysis of microcomponents deflections under different loading and the stress distribution in beams is determined and compared with the experimental measurements performed using atomic force microscope. The modeling of a micromembrane supported by four hinges that enable out-of-plane and in-plane motions is presented. Finite element analysis and experimental investigations are performed to estimate the deflection of the mobile plate of the micromembrane under an applied force and to visualize the distribution of the stress in hinges. In additional, this paper provides analytical relations for stiffness and stresses of the investigated flexible MEMS components.
Research center :
Université de Liège, Département Aérospatiale et Mécanique
Disciplines :
Mechanical engineering
Author, co-author :
Pustan, Marius ;  Université de Liège - ULiège > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures
Paquay, Stéphane;  Open Engineering SA Belgium
Rochus, Véronique ;  Université de Liège - ULiège > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures
Golinval, Jean-Claude  ;  Université de Liège - ULiège > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures
Language :
English
Title :
Modeling and Finite Element Analysis of Mechanical Behavior of Flexible MEMS Components
Publication date :
05 May 2010
Event name :
Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS
Event organizer :
IEEE Components, Packaging and Manufacturing Technology Society and Circuits Multi-Projects
Event place :
Seville, Spain
Event date :
from 05-05-2010 to 07-05-2010
By request :
Yes
Audience :
International
Main work title :
DTIP 2010
Main work alternative title :
[en] IEEE Catalog Number CFP10DTI-PRT
Editor :
Courtois, Bernard
Publisher :
EDA Publishing, Grenoble, France
Edition :
2010
ISBN/EAN :
978-2-35500-011-9
Collection name :
Catalog Number CFP10DTI-PRT
Pages :
171-176
Name of the research project :
Project MOMIVAL
Funders :
Ministère de la Région Wallonne, Division de la Recherche et de la Coopération Scientifique in the framework Programme FIRST Post-Doc
Available on ORBi :
since 14 September 2010

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