Ultra-Thinned Individual SOI Die ACF FC Bonded on Rigid and Flex PCB

Stoukatch, Serguei; Nicolas, Andre; Dupont, François; Redouté, Jean-Michel; Flandre, Denis

doi:10.23919/EMPC53418.2021.9584947

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Ultra-Thinned Individual SOI Die ACF FC Bonded on Rigid and Flex PCB

Stoukatch, Serguei; Nicolas, Andre; Dupont, François et al.

2021 • In 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Peer reviewed

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https://hdl.handle.net/2268/267019

DOI
10.23919/EMPC53418.2021.9584947

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Keywords :

Ultra-thinned SOI die; low-cost ultra-thinning; anisotropic conductive films; flip-chip bonding

Abstract :

[en] We have developed a straightforward die-level thinning process suitable for Silicon-On-Insulator (SOI) dies. The process has been demonstrated on SOI CMOS die assembled on rigid and flexible PCBs using previously-developed anisotropic conductive adhesive flip-chip method. Unlike standard wafer-level thinning processes, in the demonstrated process the full thickness SOI die is directly mounted on PCB and after that thinned. The demonstrated process is simple and robust; it comprises fewer process steps compared to conventional die thinning process. The ultra-thinning process has no effects on the assembly integrity and device performance.

Disciplines :

Electrical & electronics engineering

Author, co-author :

Stoukatch, Serguei ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Nicolas, Andre; Université Catholique de Louvain - UCL

Dupont, François ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Redouté, Jean-Michel ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Flandre, Denis; Université Catholique de Louvain - UCL

Language :

English

Title :

Ultra-Thinned Individual SOI Die ACF FC Bonded on Rigid and Flex PCB

Publication date :

13 November 2021

Event name :

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Event organizer :

IEEE

Event place :

Gothenburg, Sweden

Event date :

from 13-09-2021 to 16-09-2021

Audience :

International

Main work title :

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Publisher :

IEEE

Peer reviewed :

Peer reviewed

Name of the research project :

Microsystème_ULg Microsys project and the Micro+ project

Funders :

The work was supported by the Microsystème_ULg Microsys project, funded by the Wallonia (Belgium), and the Micro+ project cofounded by the European Regional Development Fund (ERDF) and Wallonia (Belgium).

Available on ORBi :

since 13 January 2022

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