A high precision MEMS based capacitive accelerometer for seismic measurements

MEMS; Microelectromechanical devices; Seismology; Capacitive accelerometers; Capacitive sensing; High-precision; Integrated readout; Low noise; Seismic measurements; Sensing elements; Ultra low noise; Accelerometers

Abstract :

[en] In this paper, we present a capacitive, MEMS based accelerometer comprising an ultra-low noise CMOS integrated readout-IC and a high precision bulk micro machined sensing element. The resulting accelerometer reaches an acceleration equivalent noise of only 200 ng/fHz, which makes it suitable for seismic measurement that require noise levels significantly below 1 pgAjHz. The design of the sensing element and readout-IC are presented in detail and measurement results are shown which demonstrate the performance of the sensor system. © 2017 IEEE.

Disciplines :

Electrical & electronics engineering

Author, co-author :

Utz, A.; Fraunhofer Institute for Microelectronic Circuits and Systems (IMS), Finkenstr. 61, Duisburg, 47057, Germany

Walk, C.; Fraunhofer Institute for Microelectronic Circuits and Systems (IMS), Finkenstr. 61, Duisburg, 47057, Germany

Stanitzki, A.; Fraunhofer Institute for Microelectronic Circuits and Systems (IMS), Finkenstr. 61, Duisburg, 47057, Germany

Mokhtari, M.; Mir Enterprises Limited, 173c Goldhurst Terrace, Hampstead, London, NW6 3ES, United Kingdom

Kraft, Michael ; Université de Liège - ULg

Kokozinski, R.; Fraunhofer Institute for Microelectronic Circuits and Systems (IMS), Finkenstr. 61, Duisburg, 47057, Germany, Department of Electronic Components and Circuits, University of Duisburg-Essen, Bismarckstr. 81, Duisburg, 47057, Germany

Language :

English

Title :

A high precision MEMS based capacitive accelerometer for seismic measurements

Publication date :

2017

Event name :

16th IEEE SENSORS Conference, ICSENS 2017

Event date :

30 October 2017 through 1 November 2017

Audience :

International

Journal title :

Proceedings of IEEE Sensors

ISSN :

1930-0395

eISSN :

2168-9229

Publisher :

Institute of Electrical and Electronic Engineers (IEEE), Piscataway, United States - New Jersey

Volume :

2017-December

Pages :

1-3

Peer reviewed :

Peer Reviewed verified by ORBi

Funders :

IEEE Sensors Council

Available on ORBi :

since 12 September 2021

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Bibliography

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