[en] This work investigates electrical properties of AJP (Aerosol Jet Printing) silver layers deposited at low temperature on variety of conventional and non-conventional for electronic application organic substrates such as polyimide, FR4, polycarbonate (PC), and acrylonitrile butadiene styrene (ABS). We measured resistance at DC and studied complex impedance on AC voltages at six frequencies: 60 Hz, 1 kHz, 10 kHz, 100 kHz, 1 MHz and 2 MHz. Up to a frequency of 100 kHz the value of resistance remains approximately constant and up to 1–2 MHz we observed slight increase in electric losses. The effect of thermal treatment on the electrical performance of AJP layer was also investigated. Generally speaking, the thermal treatment improves the electrical properties of investigated samples. Because of relatively low resistivity (16 μΩ∗cm) and low reactance of the AJP deposited silver layers, are good enough to support a wide variety of electronic applications for a frequency range up to 1–2 MHz. We also demonstrated that for specific applications, such as for Internet of Things (IoT), conventional interconnection techniques such as wire bonding can be successfully replaced by AJP deposited conductive silver tracks.
Disciplines :
Electrical & electronics engineering
Author, co-author :
Laurent, Philippe ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Stoukatch, Serguei ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Dupont, François ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Kraft, Michael ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Language :
English
Title :
Electrical characterization of Aerosol Jet Printing (AJP) deposited conductive silver tracks on organic materials
Publication date :
2018
Journal title :
Microelectronic Engineering
ISSN :
0167-9317
Publisher :
Elsevier B.V.
Volume :
197
Pages :
67-75
Peer reviewed :
Peer Reviewed verified by ORBi
Funders :
Région wallonne FEDER - Fonds Européen de Développement Régional
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Bibliography
Stoukatch, S., Chapter 2. Low-temperature microassembly methods and integration techniques for biomedical applications. Salvo, P., Hernandez-Silveira, M., (eds.) Wireless Medical Systems and Algorithms Design and Applications, 2016, CRC Press, 21–42.
Stoukatch, S., Seronveaux, L., Laurent, P., Dricot, S., Axisa, F., Vandormael, D., Beeckman, E., Heusdens, B., Destiné, J., Evaluation of aerosol jet printing (AJP) technology for electronic packaging and interconnect technique. Proc. The 4th Electronics System Integration Technology Conferences (ESTC 2012), Amsterdam, The Netherlands, Sept 17–20, 2012.
Zhao, D. et al., Conductivity enhancement of aerosol-jet printed electronics by using silver nanoparticles ink with carbon nanotubes. J. Microelectron. Eng. 96 (August 2012), 71–75 (Elsevier Science Ltd. Oxford, UK).
Seifert, T. et al., Additive manufacturing technologies compared: morphology of deposits of silver ink using inkjet and aerosol jet printing. Ind. Eng. Chem. Res. 54:2 (2015), 769–779.
Alias, Rosidah, Shapee, Sabrina Mohd, Rheological behaviors and their correlation with printing performance of silver paste for LTCC tape. De Vicente, Juan, (eds.) Rheology, 2012, InTech (ISBN: 978-953-51-0187-1).
Heraeus hybrid pastes. from www.heraeus.com. (Accessed 21 September 2017)
Aerosol Jet 300 Series Systems. from www.optomec.com. (Accessed 21 September 2017)
Stoukatch, S., Dupont, F., Seronveaux, L., Vandormael, D., Kraft, M., Additive low temperature 3D printed electronic as enabling technology for IoT application. Electronics Packaging Technology Conference (EPTC), 2017, IEEE, 1–6 (19th).
Verheecke, W. et al., Optimization Aerosol Jet Printing of silver interconnects on polyimide film for embedded electronics applications. 8th International DAAAM Baltic Conference “Industrial Engineering”, Tallinn, Estonia, in Conf. Proc., 19–21 April 2012, 373–379.
Smith, M., Choi, Y.C., Boughey, C., Kar-Narayan, S., Controlling and assessing the quality of aerosol jet printed features for large area and flexible electronics. Flex. Print. Electron., 2, 2017.
Kaestle, C., Hoerber, J., Oechsner, F., Franke, J., Prospects of wire bonding as an approach for contacting additive manufactured Aerosol Jet printed structures. 2015 European Microelectronics Packaging Conference (EMPC), 2015, 1–6.
Harper, Charles A., Electronic Packaging and Interconnection Handbook. 4th edition, 2004, McGraw-Hill (1000 pp.).
EPO-TEK® complete list of products. from www.epotek.com. (Accessed 21 September 2017)
Data sheets & certifications. from www.henkel-adhesives.com. (Accessed 21 September 2017)
Licari, J.J., Swanson, D.W., Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. 2011, William Andrew Publishing, 512.
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