STANDARD pool – your default choice for your PCB – Eurocircuits. [Online]. Available: http://www.eurocircuits.com/standard-pool-your-default-choice-for-your-pcb/. [Accessed: 28-Apr-2017].
Rahim, K., Mian, A., A review on laser processing in electronic and MEMS packaging. J Electron Packag, 139(3), 2017.
Whitaker, J.C., The electronics handbook. 2nd Ed., 2005, CRC Press.
Grzesik, Wit, Advanced machining processes of metallic Materials: theory, modelling and applications. 2nd Ed., 2016, Elsevier.
Kim, K.R., et al. High-precision and ultrafast UV laser system for next-generation flexible PCB drilling. J Manuf Syst 38 (2016), 107–113.
D.J. Meier and S.H. Schmidt, PCB laser technology for rigid and flex HDI – via formation, structuring, routing. [Online]. Available: http://www.lpkfusa.com/articles/hdi/pcb_laser_technology.pdf. [Accessed: 07-Jul-2017].
Tunna, L., Kearns, A., O'Neill, W., Sutcliffe, C.J., Micromachining of copper using Nd:YAG laser radiation at 1064, 532, and 355 nm wavelengths. Opt Laser Technol 33:3 (2001), 135–143.
Stafford, S., Printed circuit board processing with UV lasers. Ind Laser Solut, 2014, 16–18 no. March/April.
Patel, R.S., Bovatsek, J., Processing benefits of high repetition rate and high average power 355 nm laser for micromachining of microelectronics packaging materials. SPIE 6459, 2007, The International Society for Optical Engineering.
Berenyi, R., Ruszinko, M., Szekely, I., UV laser based direct structuring. 2016 39th international spring seminar on electronica technology (ISSE), 2016, 367–371.
Shin, B.S., Oh, J.Y., Sohn, H., Theoretical and experimental investigations into laser ablation of polyimide and copper films with 355-nm Nd:YVO4 laser. J Mater Process Technol 187–188 (2007), 260–263.
Spectra Physics, Talon laser datasheet. [Online]. Available: http://www.spectra-physics.com/assets/client_files/files/documents/datasheets/Talon.DataSheet.pdf. [Accessed: 28-Apr-2017].
Wang, X.C., Li, Z.L., Chen, T., Lok, B.K., Low, D.K.Y., 355 nm DPSS UV laser cutting of FR4 and BT/epoxy-based PCB substrates. Opt Lasers Eng 46:5 (2008), 404–409.
Goodfellow, Material properties goodfellow Catalogue. [Online]. Available: http://www.goodfellow.com/catalogue/GFCat2.php?ewd_token=AZjD8fgjOr4sEIp9uMddp0atBANmTv&n=5cSDI3m6RrV5bTypBk3tRWp2RfXYqv. [Accessed: 28-Apr-2017].
Lide, D.R., Handbook of chemistry and physics. 84th Ed., 2003, CRC Press.
E. ToolBox, Boiling points and specific heat of liquid metals. [Online]. Available: http://www.engineeringtoolbox.com/liquid-metal-boiling-points-specific-heat-d_1893.html. [Accessed: 07-Jun-2017].
M.N. Polyanskiy, Refractive index database. [Online]. Available: https://refractiveindex.info. [Accessed: 28-Apr-2017].
Ulieru, D., Matei, A., Ulieru, E., Tantau, A., Babarada, F., High density interconnections fabrication by UV Lasers microprocessing of microvias and microstructures. International conference multi-material micro manufacture 4M2008, 2008, 73–77.
