Reference : Nanoprecision alignment for wafer bonding
Scientific congresses and symposiums : Paper published in a book
Engineering, computing & technology : Electrical & electronics engineering
http://hdl.handle.net/2268/192159
Nanoprecision alignment for wafer bonding
English
Jiang, Liudi [> >]
Pandraud, Gregory [> >]
French, Paddy James [> >]
Spearing, S. Mark [> >]
Kraft, Michaël mailto [Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés >]
Sep-2006
The 17th Micromechanics Europe Workshop, MME'06
pp.101-104
Yes
Yes
International
Proc. MME 2006 Conference
September 2006
UK
Researchers ; Professionals ; Students
http://hdl.handle.net/2268/192159
101--104

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