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Realisation of electroplating moulds with different thick photoresists for MEMS applications
Kukharenka, A.; Kraft, Michael
2002 • In Proc. 4th International Conference on Material for Microelectronics and Nanoengineering
Peer reviewed
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https://hdl.handle.net/2268/187861
 

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Disciplines :
Electrical & electronics engineering
Author, co-author :
Kukharenka, A.
Kraft, Michael ;  Université de Liège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Language :
English
Title :
Realisation of electroplating moulds with different thick photoresists for MEMS applications
Publication date :
June 2002
Event name :
Proc. 4th International Conference on Material for Microelectronics and Nanoengineering
Event place :
Espoo, Finland
Event date :
Juin 2002
By request :
Yes
Audience :
International
Main work title :
Proc. 4th International Conference on Material for Microelectronics and Nanoengineering
Pages :
pp. 165-168
Peer reviewed :
Peer reviewed
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since 09 November 2015

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