Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance

Baine, P.; Gamble, H.S.; Armstrong, B.M.; Bain, M.; McNeill, D.W.; Stefanou; Kraft, Michael

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Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance

Baine, P.; Gamble, H.S.; Armstrong, B.M. et al.

2003 • In 7th Int. Symp. on Semi-conductor Wafer Bonding

Peer reviewed

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https://hdl.handle.net/2268/187819

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Disciplines :

Electrical & electronics engineering

Author, co-author :

Baine, P.

Gamble, H.S.

Armstrong, B.M.

Bain, M.

McNeill, D.W.

Stefanou

Kraft, Michael ; Université de Liège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Language :

English

Title :

Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance

Publication date :

May 2003

Event name :

7th Int. Symp. on Semi-conductor Wafer Bonding

Event place :

Paris, France

Event date :

Mai 2003

By request :

Yes

Audience :

International

Main work title :

7th Int. Symp. on Semi-conductor Wafer Bonding

Pages :

pp. 57-63

Peer reviewed :

Peer reviewed

Available on ORBi :

since 09 November 2015

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Bibliography

J. Raskin, A.Vivianai, D. Flandre, and J. Colinge, IEEE Trans. Electron Devices, 44, 2252 (1997).
H.S. Gamble, B.M. Armstrong, P. Baine, M. Bain, and D.W. McNeill, Solid-State Electronics, 45, 551 (2001).
J.S. Hamel, S. Stefanou, M. Bain, B.M. Armstrong, and H.S. Gamble, IEEE Microwave and Guided Wave Letters, 4, 134 (2000)
C. Patrick Yue, and S. Simon Wong, IEEE Journal of Solid-State Circuits, 33, 743 (1998)
M. Bain, private communication.
S. Mohan, M. Hershenson, S. Boyd, and T. Lee, IEEE Journal of Solid-State Circuits, 34, 1419 (1999)