Reference : Fabrication of MEMS components using ultra fine grained aluminium
Scientific journals : Article
Engineering, computing & technology : Electrical & electronics engineering
Fabrication of MEMS components using ultra fine grained aluminium
Qiao, X. []
Gao, N. []
Moktadir, Z. []
Kraft, Michael mailto [Université de Liège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés >]
Starvink, M.J. []
Journal of Micromechanics and Microengineering
Institute of Physics
[en] A novel process for the fabrication of a microelectromechanical systems (MEMS) metallic component with features smaller than 10 µm and high thermal conductivity was investigated. This may be applied to new or improved microscale components, such as (micro-) heat exchangers. In the first stage of processing, equal channel angular pressing (ECAP) was employed to refine the grain size of commercial purity aluminium (Al-1050) to the ultrafine-grained (UFG) material. Embossing was conducted using a micro silicon mould fabricated by deep reactive ion etching (DRIE). Both cold embossing and hot embossing were performed on the coarse-grained and UFG Al-1050. Cold embossing on UFG Al-1050 led to a partially transferred pattern from the micro silicon mould and high failure rate of the mould. Hot embossing on UFG Al-1050 provided a smooth embossed surface with a fully transferred pattern and a low failure rate of the mould, while hot embossing on the coarse-grained Al-1050 resulted in a rougher surface with shear bands.
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