Reference : Microembossing of ultrafine grained Al: Microstructural analysis and finite element m...
Scientific journals : Article
Engineering, computing & technology : Electrical & electronics engineering
Microembossing of ultrafine grained Al: Microstructural analysis and finite element modeling
Qiao, Xiao Guang [> >]
Gao, Nong [> >]
Moktadir, Zakaria [> >]
Kraft, Michaël mailto [Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés >]
Starnik, Marco J. [> >]
Journal of Micromechanics and Microengineering
Institute of Physics
Yes (verified by ORBi)
[en] Ultra-fine-grained (UFG) Al-1050 processed by equal channel angular pressing and UFG
Al–Mg–Cu–Mn processed by high-pressure torsion (HPT) were embossed at both room
temperature and 300 ◦C, with the aim of producing micro-channels. The behaviour of Al
alloys during the embossing process was analysed using finite element modelling. The cold
embossing of both Al alloys is characterized by a partial pattern transfer, a large embossing
force, channels with oblique sidewalls and a large failure rate of the mould. The hot
embossing is characterized by straight channel sidewalls, fully transferred patterns and
reduced loads which decrease the failure rate of the mould. Hot embossing of UFG
Al–Mg–Cu–Mn produced by HPT shows a potential of fabrication of microelectromechanical
system components with micro channels.
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