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| Reference : Microembossing of ultrafine grained Al: Microstructural analysis and finite element m... |
| Scientific journals : Article | |||
| Engineering, computing & technology : Electrical & electronics engineering | |||
| http://hdl.handle.net/2268/186032 | |||
| Microembossing of ultrafine grained Al: Microstructural analysis and finite element modeling | |
| English | |
| Qiao, Xiao Guang [> >] | |
| Gao, Nong [> >] | |
| Moktadir, Zakaria [> >] | |
Kraft, Michaël  [Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés >] | |
| Starnik, Marco J. [> >] | |
| 2010 | |
| Journal of Micromechanics and Microengineering | |
| Institute of Physics | |
| 20 | |
| 4 | |
| 045029 | |
| Yes (verified by ORBi) | |
| International | |
| 0960-1317 | |
| [en] Ultra-fine-grained (UFG) Al-1050 processed by equal channel angular pressing and UFG
Al–Mg–Cu–Mn processed by high-pressure torsion (HPT) were embossed at both room temperature and 300 ◦C, with the aim of producing micro-channels. The behaviour of Al alloys during the embossing process was analysed using finite element modelling. The cold embossing of both Al alloys is characterized by a partial pattern transfer, a large embossing force, channels with oblique sidewalls and a large failure rate of the mould. The hot embossing is characterized by straight channel sidewalls, fully transferred patterns and reduced loads which decrease the failure rate of the mould. Hot embossing of UFG Al–Mg–Cu–Mn produced by HPT shows a potential of fabrication of microelectromechanical system components with micro channels. | |
| Researchers ; Professionals ; Students | |
| http://hdl.handle.net/2268/186032 | |
| 10.1088/0960-1317/20/10/105002 | |
| http://iopscience.iop.org/0960-1317/20/4/045029/ |
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