Chemically resistant encapsulation for MEMS release

We have proposed and explored a novel sequence in MEMS fabrication process flow. The novel MEMS fabrication process flow can be shortly described as a “packaging first, MEMS release second”. We propose to package the MEMS device first (die mount, wire bonding and encapsulation) and to perform the MEMS release as the last step in the fabrication process flow. The standard route for IC manufacturing is, that the die packaging is the last step [1]. Such approach can’t be directly transferred and used for MEMS fabrication [2]. The main reason for that, that the MEMS device after the release becomes vulnerable to any physical and chemical exposure. Such exposure can occur during transportation, handling or any post-processing (incl. the packaging).