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On the Advantages of Using a Strong Coupling Variational Formulation to Model Electro-Mechanical Problem
Rochus, Véronique; Rixen, D. J.; Golinval, Jean-Claude
2006In Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems, Proceedings of EuroSimE 2006
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Keywords :
Strong Coupling Variational Formulation; Model Electro-Mechanical Problem; MEMS; nonlinear algorithms; Finite element; topology optimisation
Abstract :
[en] This paper presents the advantages of a strong coupled formulation to model the electro-mechanical coupling appearing in MEMS. Usually the classical softwares use a staggered methodology iterating between two different codes to obtain the solution of the coupled problem. In this research a strong coupled formulation is proposed and a tangent stiffness matrix of the whole problem is computed. Using this matrix, nonlinear algorithms such as the Riks-Crisfield algorithm may be applied to solve the static nonlinear problem and determine accurately the static pull-in voltage. Moreover, the natural frequencies may be computed around each equilibrium positions. The dynamic behaviour of the structure may also be studied and two new parameters are defined: the dynamic pull-in voltage and the dynamic pull-in time. This strong coupled methodology deriving from variational principle may also be used for topology optimisation and extended finite elements.
Disciplines :
Mechanical engineering
Mathematics
Author, co-author :
Rochus, Véronique ;  Université de Liège - ULiège > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures
Rixen, D. J.;  2T.U. Delft, O.C.P, Engineering Dynamics, Delft, The Netherlands
Golinval, Jean-Claude  ;  Université de Liège - ULiège > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures
Language :
English
Title :
On the Advantages of Using a Strong Coupling Variational Formulation to Model Electro-Mechanical Problem
Publication date :
April 2006
Event name :
7th IEEE EuroSimE conference
Event place :
Como, Italy
Audience :
International
Main work title :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems, Proceedings of EuroSimE 2006
ISBN/EAN :
1-4244-0275-1
Peer reviewed :
Peer reviewed
Available on ORBi :
since 27 November 2009

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