Reference : Modelling of the squeeze film air damping in MEMS
Scientific congresses and symposiums : Paper published in a book
Engineering, computing & technology : Mechanical engineering
Engineering, computing & technology : Electrical & electronics engineering
Modelling of the squeeze film air damping in MEMS
Barroso, Juan José Gómez [Universidad Nacional del Litoral, Santa Fe, Argentina > CIMEC-INTEC > > >]
Bruls, Olivier mailto [Université de Liège - ULiège > Département d'aérospatiale et mécanique > Laboratoire des Systèmes Multicorps et Mécatroniques >]
Berli, Claudio [Universidad Nacional del Litoral, Santa Fe, Argentina > CIMEC-INTEC > > >]
Cardona, Alberto [Universidad Nacional del Litoral, Santa Fe, Argentina > CIMEC-INTEC > > >]
Proceedings of the ENIEF Conference
ENIEF Conference
November 2009
[en] MEMS ; Squeeze-film ; Numerical modelling
[en] We propose a formulation for modeling the squeeze film air damping in micro-plates typical of micro-electromechanical devices for micro switch applications. A special finite element is developed, in which the nonlinear Reynolds equation for compressible film is used to analyze the air pressure field, whereas a standard linear elastic model is used for the displacement field. The formulation is based on a finite element discretization of both the pressure and displacement fields. The coupled equations of motion are established and, for harmonic oscillations, we show that the resulting damping matrix depends on the frequency. The typical dimensions and properties of the MEMS device are in the order of hundred micrometers length and some micrometers (3-8 micrometers) thick, with a separation from the substrate of also some micrometers (e.g. 3-5 micrometers). For these dimensions, the influence of damping owing to the surrounding air cannot be neglected, having an important contribution to the quality factor of the device. The influence of plate holes, which are necessary because of the fabrication process, determines also the dynamic behavior of the plate. Examples are presented, with comparisons to results of the bibliography.
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