[en] This research paper provides an extensive examination of electromagnetic interference (EMI) in wireline transceiver systems. Wireline transceiver circuits are particularly susceptible to undesired electromagnetic waves in their environment. The paper delves into a mathematical approach for incorporating EMI into circuit simulation tools. Additionally, it explores the impact of EMI on different wireline communication systems, such as LVDS, CML, and PAM-4 transceiver systems. The goal is to comprehensively understand how EMI affects the performance of these wireline communication systems.
Disciplines :
Electrical & electronics engineering
Author, co-author :
Choudhary, Mohit Singh; Department of Electrical Engineering, Indian Institute of Technology, Mumbai, India
Redouté, Jean-Michel ; Université de Liège - ULiège > Département d'électricité, électronique et informatique (Institut Montefiore) > Systèmes microélectroniques intégrés
Baghini, Maryam Shojaei; Department of Electrical Engineering, Indian Institute of Technology, Mumbai, India
Language :
English
Title :
Comprehensive Study of EMI Effects on Wireline Transceiver Systems: A review of silicon-proven techniques
Publication date :
2024
Event name :
2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Event place :
Torino, Ita
Event date :
07-10-2024 => 09-10-2024
Main work title :
2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024
Publisher :
Institute of Electrical and Electronics Engineers Inc.
S. Saxena, “Wireline communication: the backbone of data transfer,” CSI Transactions on ICT, vol. 8, pp. 147–156, 2020.
A. Athavale and C. Christensen, “High-speed serial I/O made simple,” Xilinx inc, vol. 4, 2005.
J.-M. Redoute and M. Steyaert, EMC of Analog Integrated Circuits. Springer Netherlands, 2010.
S. B. Dhia, M. Ramdani, and E. Sicard, Electromagnetic Compatibility of Integrated Circuits: Techniques for low emission and susceptibility. Springer Science & Business Media, 2006.
N. S. A. K. Pudi, S. Boyapati, J.-M. Redouté, and M. S. Baghini, “Analytical and experimental validation of robustness of the current mirrors to emi,” IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 6, pp. 1907–1914, 2018.
S. Boyapati, J.-M. Redouté, and M. Shojaei Baghini, “Design of a novel highly emi-immune cmos miller opamp considering channel length modulation,” IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 64, no. 10, pp. 2679–2690, 2017.
Wenjie Chen, Xu Yang, and Zhaoan Wang, “An active EMI filtering technique for improving passive filter low-frequency performance,” IEEE Transactions on Electromagnetic Compatibility, vol. 48, no. 1, pp. 172–177, Feb 2006.
S. Shahparnia and O. M. Ramahi, “Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures,” IEEE Transactions on Electromagnetic Compatibility, vol. 46, no. 4, pp. 580–587, 2004.
R. S. Y. Hui and S. C. Tang, “Planar printed circuit-board transformers with effective electromagnetic interference (EMI) shielding,” May 3 2005, uS Patent 6,888,438.
D. A. Ice and L. B. Aronson, “Angled EMI shield for transceiver-PCB interface,” May 17 2005, uS Patent 6,893,293.
M. Zhang, Y. Li, C. Jia, and L. Li, “Simultaneous Switching Noise Suppression in Printed Circuit Boards Using a Compact 3-D Cascaded Electromagnetic-Bandgap Structure,” IEEE Transactions on Microwave Theory and Techniques, vol. 55, no. 10, pp. 2200–2207, Oct 2007.
G. A. Matig-A, M. R. Yuce, and J. M. Redouté, “An Integrated LVDS Transmitter in 0.18-µm CMOS Technology With High Immunity to EMI,” IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 1, pp. 128–134, Feb 2015.
G. E. Matig-A, M. R. Yuce, and J. M. Redoute, “Design of a CML Transceiver With Self-Immunity to EMI in 0.18-µm CMOS,” IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 64, no. 4, pp. 981–991, April 2017.
AN 835: PAM4 Signaling Fundamentals[White paper]. Intel, March 2019. [Online]. Available: https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/an835.pdf
IEC 62132-4:2006: Integrated Circuits - Measurement of Electromagnetic Immunity, 150 KHz to 1 GHz - Part 4: Direct RF Power Injection method, Std. [Online]. Available: https://webstore.iec.ch/publication/6510
IEC 62132-2:2010: Integrated Circuits - Measurement of Electromagnetic Immunity- Part 2: Measurement of Radiated Immunity - TEM cell and wideband TEM cell method, Std. [Online]. Available: https://webstore.iec.ch/publication/6508
IEC 62132-1:2015: Integrated Circuits - Measurement of Electromagnetic Immunity - Part 1: General conditions and definitions, Std. [Online]. Available: https://webstore.iec.ch/publication/23626
M. S. Choudhary, N. S. A. K. Pudi, J.-M. Redouté, and M. S. Baghini, “A methodology to emulate the effect of emi in circuit simulators for wireline communication channel,” IEEE Letters on Electromagnetic Compatibility Practice and Applications, vol. 3, no. 3, pp. 96–100, 2021.
G. A. Matig-A, M. R. Yuce, and J.-M. Redouté, “An Integrated LVDS Transmitter“Receiver System With Increased Self-Immunity to EMI in 0.18- µm CMOS,” IEEE Transactions on Electromagnetic Compatibility, vol. 58, no. 1, pp. 231–240, 2016.
G. A. Matig-A, M. R. Yuce, and J. Redouté, “An Integrated LVDS Transmitter–Receiver System With Increased Self-Immunity to EMI in 0.18- µm CMOS,” IEEE Transactions on Electromagnetic Compatibility, vol. 58, no. 1, pp. 231–240, Feb 2016.
Tektronix, “PAM4 signaling in high speedserial technology: Test, analysis,and debug.” [Online]. Available: http://www.tek.com/dl/55W_ 60273_1_HR_Letter.pdf
M. S. Choudhary, N. S. A. K. Pudi, J. Redouté, and M. S. Baghini, “An EMI Immune PAM4 Transmitter in 130 nm BiCMOS Technology,” in 2019 IEEE MTT-S International Microwave and RF Conference (IMaRC), Dec 2019, pp. 1–4.
M. S. Choudhary, S. Goyal, N. S. A. K. Pudi, J.-M. Redoute, and M. S. Baghini, “An emi-immune pam-4 transmitter with input level shifter in 130-nm bicmos technology,” IEEE Letters on Electromagnetic Compatibility Practice and Applications, vol. 3, no. 4, pp. 109–113, 2021.
Choudhary, Mohit Singh and Goyal, Sandeep and Pudi, Naga Surya Anjan Kumar and Redoute, Jean-Michel and Baghini, Maryam Shojaei, “An electromagnetic interference immune pam-4 transceiver system,” IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 4, pp. 1098–1107, 2023.
M. S. Choudhary, “Highly EMI-Immune Nano-Scale Integrated Circuits For High-speed Wireline Communication,” 12 2022. [Online]. Available: https://bridges.monash.edu/articles/thesis/Highly_ EMI-Immune_Nano-Scale_Integrated_Circuits_For_High-speed_ Wireline_Communication/21747917
