[en] Unmanned Aircraft Systems (UAS), with the ability to fly close to the ground and under clouds, make it possible to collect data at unprecedented spatial and temporal resolutions. LiDAR systems are more commonly being used on UAS platforms as these sensors become smaller and more accessible. Within the field of precision farming, UAS LiDAR is often used for height calculations that takes advantage of its ability to penetrate through the canopy to the ground but the rate at which these signals pass through can provide important metrics on crop structure and (vegetation) density. These can be related to well known (or classically used) vegetation indices such as Leaf Area Index (LAI) which often plays a major contributor in monitoring plant health and predicting crop yield. This study exploits UAS LiDAR advantages and investigates its ability to estimate LAI for crops such as winter wheat. It was found that LiDAR LAI spatial patterns were consistent with other forms of data while providing estimates similar to ground measurements.
Bates, Jordan Steven; Institute of Bio- and Geosciences: Agrosphere (IBG-3), Forschungszentrum Jülich GmbH, Jülich, Germany
Montzka, Carsten; Institute of Bio- and Geosciences: Agrosphere (IBG-3), Forschungszentrum Jülich GmbH, Jülich, Germany
Schmidt, Marius; Institute of Bio- and Geosciences: Agrosphere (IBG-3), Forschungszentrum Jülich GmbH, Jülich, Germany
Jonard, François ; Université de Liège - ULiège > Département de géographie ; Institute of Bio- and Geosciences: Agrosphere (IBG-3), Forschungszentrum Jülich GmbH, Jülich, Germany ; Earth and Life Institute, Université catholique de Louvain, Belgium
Language :
English
Title :
FUAS LIDAR CROP LAI ESTIMATIONS FROM CANOPY DENSITY
Publication date :
2021
Event name :
2021 IEEE International Geoscience and Remote Sensing Symposium IGARSS
Event place :
Brussels, Belgium
Event date :
12-07-2021 => 16-07-2021
Audience :
International
Main work title :
IGARSS 2021 - 2021 IEEE International Geoscience and Remote Sensing Symposium, Proceedings
Publisher :
Institute of Electrical and Electronics Engineers Inc.
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