Modeling of the fabrication and operation of 3-D self-assembled SOI MEMS

Mendez, Carlos; Louis, Christophe; Paquay, Stéphane; De Vincenzo, Pascal; Klapka, Igor; Rochus, Véronique; Iker, François; André, Nicolas; Raskin, Jean-Pierre

doi:10.1109/ESIME.2006.1643957

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Modeling of the fabrication and operation of 3-D self-assembled SOI MEMS

Mendez, Carlos; Louis, Christophe; Paquay, Stéphane et al.

2006

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https://hdl.handle.net/2268/31155

DOI
10.1109/ESIME.2006.1643957

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Disciplines :

Mechanical engineering

Author, co-author :

Mendez, Carlos

Louis, Christophe

Paquay, Stéphane

De Vincenzo, Pascal

Klapka, Igor

Rochus, Véronique ; Université de Liège - ULiège > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures

Iker, François

André, Nicolas

Raskin, Jean-Pierre; Université Catholique de Louvain - UCL

Language :

English

Title :

Modeling of the fabrication and operation of 3-D self-assembled SOI MEMS

Publication date :

2006

Event name :

Proceedings of Design, Test, Integration and Packaging

Event place :

Stresa, Italy

Audience :

International

Available on ORBi :

since 02 December 2009

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Bibliography

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D. Flandre, J. Laconte, D. Levacq, A. Afzalian, B. Rue, C. Renaux, F. Iker, B. Olbrechts, N. André and J.-P. Raskin, "SOI technology for single-chip harsh environment microsystems", (invited paper), CANEUS - Conference on Micro-Nano-Technologies for Aerospace Applications, Monterey, CA, USA, October 30 - November 5, 2004.
F. Iker, N. André, J. Proost, T. Pardoen and J.-P. Raskin, "Fabrication and modeling of 3-D self-assembled SOI MEMS using plasticity features", 18th IEEE International Conference on MicroElectroMechanical Systems - MEMS 2005, Miami, FL, USA, Jan. 30 - Feb. 3, 2005, pp. 459-462.
R. M. Jones, Mechanics of composite materials (2nd ed.), Taylor & Francis, Inc., Philadelphia, 1999.
M. Ataka, A. Omokada, N. Takeshima and H. Fujita, "Polymide bimorph actuators for a cyliary motion system", IEEE Journal of Microelectromechanical Systems, Vol. 2. no4(1993), p. 146-150.