thermal modeling; thermal management of electronic packages; finite element modeling (FEM); MOX sensor packaging; microassembly
Abstract :
[en] We designed a 3D geometrical model of a metal-oxide gas sensor and its custom packaging and used it in finite element modeling (FEM) analysis for obtaining temperature and heat flux distribution. The 3D computer simulation, performed with GetDP software (version 3.5.0, 13 May 2022), accurately predicted the temperature distribution variation across the entire assembly. Knowing the temperature variation and the location of the hot spots allowed us to select the best electrical interconnect method and to choose the optimal materials combination and optimal geometry. The thermal modeling also confirmed the need to use a low thermal conductivity material to insulate the MOX sensor since the latter is heated to its operational temperature of 250 °C. For that purpose, we used the in-house formulated xerogel–epoxy composite of thermal conductivity of 0.108 W m−1 K−1, which is at least 30% less compared to the best-in-class among commercially available materials. Based on the 3D FEM outputs, we designed, assembled, and characterized a fully functional packaged MOX gas sensor in several configurations. We measured the temperature distribution on all parts of the MOX gas sensor assembly using a thermal imaging infrared (IR) microscope. The results of 3D FEM are in good agreement with the temperature distribution obtained by the non-contact IR thermal characterization.
Disciplines :
Electrical & electronics engineering
Author, co-author :
Stoukatch, Serguei ; Université de Liège - ULiège > Département d'électricité, électronique et informatique (Institut Montefiore) > Systèmes microélectroniques intégrés
Dupont, François ; Université de Liège - ULiège > Département d'électricité, électronique et informatique (Institut Montefiore) > Systèmes microélectroniques intégrés
Laurent, Philippe ; Université de Liège - ULiège > Département d'électricité, électronique et informatique (Institut Montefiore) > Systèmes microélectroniques intégrés
Redouté, Jean-Michel ; Université de Liège - ULiège > Département d'électricité, électronique et informatique (Institut Montefiore) > Systèmes microélectroniques intégrés
Language :
English
Title :
Package Design Thermal Optimization for Metal-Oxide Gas Sensors by Finite Element Modeling and Infra-Red Imaging Characterization
Wallonia-Brussels Federation [BE] ERDF - European Regional Development Fund [BE]
Funding number :
No. 675781-642409
Funding text :
The work was supported by the Microsystème_ULg Microsys project, funded by the
Wallonia (Belgium), and the Micro+ project (No. 675781-642409) co-funded by the European Regional
Development Fund (ERDF) and Wallonia (Belgium).
Albrecht J.D. Altman D.H. Maurer J.J. Encyclopedia of Thermal Packaging, Set 3: Thermal Packaging Applications, Volume 2: Thermal Management of RF Systems World Scientific Singapore 2018 172 10.1142/10975-vol2
Khazaka R. Mendizabal L. Henry D. Hanna R. Survey of High-Temperature Reliability of Power Electronics Packaging Components IEEE Trans. Power Electron. 2015 30 2456 2464 10.1109/TPEL.2014.2357836
Broughton J. Smet V. Tummala R. Joshi Y.K. Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes J. Electron. Packag. 2018 140 040801 10.1115/1.4040828
Cengel Y. Ghajar A. Heat and Mass Transfer: Fundamentals and Applications Cooling of Electronic Equipment McGraw Hill New York, NY, USA 2020 Chapter 15 992
Wang H. Ma J. Tan S. Zhang C. Tang H. Huang K. Zhang Z. Hierarchical dynamic thermal management method for high-performance many-core microprocessors ACM Trans. Des. Autom. Electron. Syst. (TODAES) 2016 22 1 21 10.1145/2891409
Salvi S.S. Jain A. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs) IEEE Trans. Compon. Packag. Manuf. Technol. 2021 11 802 821 10.1109/TCPMT.2021.3064030
Torregiani C. Oprins H. Vandevelde B. Beyne E. De Wolf I. Compact thermal modeling of hot spots in advanced 3D-stacked ICs Proceedings of the 11th Electronics Packaging Technology Conference 2009 Singapore 9–11 December 2009 131 136 10.1109/EPTC.2009.5416563
Božanić M. Sinha S. Multi-chip Modules and Multi-chip Packaging Systems-Level Packaging for Millimeter-Wave Transceivers. Smart Sensors, Measurement and Instrumentation Springer Cham, Switzerland 2019 Volume 34 10.1007/978-3-030-14690-0_7
Ghaisas G. Krishnan S. A Critical Review and Perspective on Thermal Management of Power Electronics Modules for Inverters and Converters Trans. Indian Natl. Acad. Eng. 2022 7 47 60 10.1007/s41403-021-00268-1
Jones-Jackson S. Rodriguez R. Yang Y. Lopera L. Emadi A. Overview of Current Thermal Management of Automotive Power Electronics for Traction Purposes and Future Directions IEEE Trans. Transp. Electrif. 2022 8 2412 2428 10.1109/TTE.2022.3147976
Lall P. Thomas T. Suhling J. Prognostication of Damage in Automotive Underhood Electronics Subjected to Temperature and Vibration Proceedings of the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) San Diego, CA, USA 29 May–1 June 2018 1330 1341 10.1109/ECTC.2018.00204
Chen Y. Xie B. Long J. Kuang Y. Chen X. Hou M. Gao J. Zhou S. Fan B. He Y. et al. Interfacial Laser-Induced Graphene Enabling High-Performance Liquid-Solid Triboelectric Nanogenerator Adv. Mater. 2021 33 e2104290 10.1002/adma.202104290
Fagnard J.-F. Stoukatch S. Lauren P. Dupont F. Wolfs C. Lambert S.D. Redouté J.-M. Preparation and characterization of a thermal insulating carbon xerogel -epoxy composite adhesive for electronics applications IEEE Trans. Compon. Packag. Manuf. Technol. 2021 11 606 615 10.1109/TCPMT.2021.3059478
Liu Z. Li J. Liu X. Novel functionalized BN nanosheets/epoxy composites with advanced thermal conductivity and mechanical properties ACS Appl. Mater. Interfaces 2020 12 6503 6515 10.1021/acsami.9b21467 31933354
Cadence System Analysis Available online: https://resources.system-analysis.cadence.com/blog/msa2022-3d-ics-and-the-importance-of-heat-transfer-models (accessed on 7 August 2023)
Comsol Analyze Thermal Effects with Advanced Simulation Software Available online: https://www.comsol.com/heat-transfer-module (accessed on 7 August 2023)
Ansys, Resource Center Available online: https://www.ansys.com/resource-center/webinar/thermal-management-for-power-electronics (accessed on 7 August 2023)
Infineon Thermal System Modeling Available online: https://www.infineon.com/dgdl/Thermal+Modeling.pdf?fileId=db3a30431441fb5d011472fd33c70aa3 (accessed on 7 August 2023)
MathWorks Available online: https://www.mathworks.com/help/physmod/simscape/thermal-models.html (accessed on 7 August 2023)
M3d Available online: http://www.m3dfea.com/ (accessed on 7 August 2023)
Quickfield Product, Software Features Available online: https://quickfield.com/features.htm (accessed on 7 August 2023)
Rohm Products, Data Book Available online: https://fscdn.rohm.com/en/products/databook/applinote/discrete/transistor/what_is_a_thermal_model_tr_an-e.pdf (accessed on 7 August 2023)
Coppeta R. Lahlalia A. Kozic D. Hammer R. Riedler J. Toschkoff G. Singulani A. Ali Z. Sagmeister M. Carniello S. et al. Electro-thermal-mechanical modeling of gas sensor hotplates Sensor Systems Simulations: From Concept to Solution Springer Nature Switzerland AG Cham, Switzerland 2020 17 72 10.1007/978-3-030-16577-2_2
Subhash Joshi T.G. John V. Combined transient thermal impedance estimation for pulse-power applications Proceedings of the National Power Electronics Conference (NPEC) Pune, India 18–20 December 2017 42 47 10.1109/NPEC.2017.8310432
Cauer Thermal Model Available online: https://www.mathworks.com/help/sps/ref/cauerthermalmodel.html (accessed on 7 August 2023)
Fluids and Thermal Simulation, Simcenter Flotherm Available online: https://plm.sw.siemens.com/en-US/simcenter/fluids-thermal-simulation/flotherm/ (accessed on 7 August 2023)
Dular P. Geuzaine C. Henrotte F. Legros W. A general environment for the treatment of discrete problems and its application to the finite element method IEEE Trans. Magn. 1998 34 3395 3398 10.1109/20.717799
Gilleo K. MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes McGraw Hill LLC New York, NY, USA 2005 220 10.1036/0071455566
Basyooni M. Shaban M. El Sayed A. Enhanced Gas Sensing Properties of Spin-Coated Na-Doped ZnO Nanostructured Films Sci. Rep. 2017 7 41716 10.1038/srep41716 28145506
Rüffer D. Hoehne F. Bühler J. New Digital Metal-Oxide (MOX) Sensor Platform Sensors 2018 18 1052 10.3390/s18041052 29614746
Gardner J.W. Guha P.K. CMOS-based resistive and FET devices for smart gas sensors, Editor: E. Llobet Micro and Nano Technologies, Advanced Nanomaterials for Inexpensive Gas Microsensors Elsevier Amsterdam, The Netherlands 2020 10.1016/B978-0-12-814827-3.00007-4
Stoukatch S. Fagnard J.-F. Roy G. Laurent P. Dupont F. Jacques P.J. Redouté J.-M. Thermal conductivity characterization of an in-house formulated thermal insulating xerogel—Epoxy composite adhesive for electronics applications Proceedings of the 2022 IEEE Electronics System-Integration Technology Conference (ESTC) Sibiu, Romania 13–16 September 2022 315 320 10.1109/ESTC55720.2022.9939477
Stoukatch S. Fagnard J.-F. Laurent P. Dupont F. Debliquy M. Redouté J.-M. Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors IEEE Access 2022 10 19242 19253 10.1109/ACCESS.2022.3151356
The Engineering Toolbox, Thermal Conductivity Available online: https://www.engineeringtoolbox.com/thermal-conductivity-d_429.html (accessed on 7 August 2023)
Pertijs M.A.P. Huijsing J.H. Precision Temperature Sensors in CMOS Technology Technology & Engineering Springer Dordrecht, The Netherlands 2010 292
Childs P.R.N. Greenwood J.R. Long C.A. Review of temperature measurement Rev. Sci. Instrum. 2000 71 2959 2978 10.1063/1.1305516
Stoukatch S. Fagnard J.-F. Dupont F. Laurent P. Redouté J.-M. Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor Proceedings of the 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Singapore 7–9 December 2021 483 487 10.1109/EPTC53413.2021.9663945
OPTOTHERM Thermal Imaging System, Sentris Available online: www.optotherm.com/sentris (accessed on 7 August 2023)
Das M. Roy S. Polypyrrole and associated hybrid nanocomposites as chemiresistive gas sensors: A comprehensive review Mater. Sci. Semicond. Process. 2021 121 105332 10.1016/j.mssp.2020.105332
Das P. Maruthapandi M. Saravanan A. Natan M. Jacobi G. Banin E. Gedanken A. Carbon dots for heavy-metal sensing, pH-sensitive cargo delivery, and antibacterial applications ACS Appl. Nano Mater. 2020 3 11777 11790 10.1021/acsanm.0c02305
Stoukatch S. Dupont F. Redouté J.M. Device Processing Challenges for Miniaturized Sensing Systems Targeting Biological Fluids Biomed. Mater. Devices 2022 10.1007/s44174-022-00034-z
Das P. Ganguly S. Mondal S. Bose M. Das A.K. Banerjee S. Das N.C. Heteroatom doped photoluminescent carbon dots for sensitive detection of acetone in human fluids Sens. Actuators B Chem. 2018 266 583 593 10.1016/j.snb.2018.03.183
