[en] The thermal conductivity data provided by the manufacture are not always sufficiently accurate, and not available for newly formulated materials . However, it is crucial to obtain precise data of the thermal conductivity for low (less as 0.2 W m-1 K-1) thermal conductivity materials where measurement errors have significant impact. There are several experimental methods to measure the thermal conductivity of insulating materials. These methods can be generally divided in two broad groups: steady-state and transient methods. In our work, we compared the results of thermal conductivity obtained by 3 different methods for the in-house formulated thermally insulating xerogel - epoxy composite adhesive. We performed the steady-state thermal conductivity measurements in vacuum chamber with low pressure of 7 10-9 mbar to suppress the conduction and convection losses. The results obtained by that method were compared with data obtained using two transient methods, a laser flash analysis (LFA) and an infrared (IR) thermography method. The LFA and IR thermography are indirect methods and require at least three independent measurements to obtain the thermal conductivity. The measurements error is larger than for the steady-state method. Additionally, to that, the IR thermography method exhibits several practical complications to realize necessary conditions of thermal transfer. That results in possible measurements errors and makes it not possible to obtain the thermal conductivity accurately. The steady-state and LFA methods can be used for the characterization of the thermal conductivity for low thermal conductivity materials such xerogel-epoxy composites
Disciplines :
Electrical & electronics engineering
Author, co-author :
Stoukatch, Serguei ; Université de Liège - ULiège > Département d'électricité, électronique et informatique (Institut Montefiore) > Systèmes microélectroniques intégrés ; Liege University,Microsys lab,Department of Electrical Engineering and Computer Science,Seraing,Belgium
Fagnard, Jean-François ; Université de Liège - ULiège > Département d'électricité, électronique et informatique (Institut Montefiore) > Applied and Computational Electromagnetics (ACE) ; Liege University,Department of Electrical Engineering and Computer Science,Seraing,Belgium
Roy, Geoffrey; Materials and process engineering, Institute of Mechanics, Materials and Civil Engineering (IMMC) Université catholique de Louvain,Louvain-la-Neuve,Belgium
Laurent, Philippe ; Université de Liège - ULiège > Département d'électricité, électronique et informatique (Institut Montefiore) > Systèmes microélectroniques intégrés ; Liege University,Department of Electrical Engineering and Computer Science,Seraing,Belgium
Dupont, François ; Université de Liège - ULiège > Département d'électricité, électronique et informatique (Institut Montefiore) > Systèmes microélectroniques intégrés ; Liege University,Microsys lab,Department of Electrical Engineering and Computer Science,Seraing,Belgium
Jacques, Pascal J.; Materials and process engineering, Institute of Mechanics, Materials and Civil Engineering (IMMC) Université catholique de Louvain,Louvain-la-Neuve,Belgium
Redouté, Jean-Michel ; Université de Liège - ULiège > Département d'électricité, électronique et informatique (Institut Montefiore) > Systèmes microélectroniques intégrés ; Liege University,Microsys lab,Department of Electrical Engineering and Computer Science,Seraing,Belgium
Language :
English
Title :
Thermal conductivity characterization of an in-house formulated thermal insulating xerogel - epoxy composite adhesive for electronics applications
ERDF - European Regional Development Fund [BE] Wallonia [BE]
Funding number :
No. 675781-642409
Funding text :
The work was supported by the Microsystème_ULg Microsys project, funded by the Wallonia (Belgium), the Micro+ project (No. 675781-642409) co-funded by the European Regional Development Fund (ERDF) and Wallonia (Belgium) and the Multifunctional thin films/Locoted project co-funded by the European Regional Development Fund (ERDF) and Wallonia (Belgium).
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