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Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor
Stoukatch, Serguei; Fagnard, Jean-François; Dupont, François et al.
2022In 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Peer reviewed
 

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Keywords :
Non-contact thermal characterization; IR thermography; MOX sensors; thermal management of electronic packaging; microassembly
Abstract :
[en] Following a demand for thermal management there is need to measure precisely a temperature on the most critical part of microassembly. The widely-used contact type of measurements is often not suitable for micro parts of assembly as small as 0.5 mm and smaller. The non-contact measurements currently available are not always directly applicable on complex heterogeneous microassemblies structures such as miniaturized metal-oxide (MOX) gas sensor. In response to this, we have developed a simple technique using IR thermography for accurate and non-contact temperature measurements of electronic microassemblies, and validate this approach with MOX sensors heated to operating temperature of 250-300°C.
Disciplines :
Electrical & electronics engineering
Author, co-author :
Stoukatch, Serguei  ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Fagnard, Jean-François  ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Applied and Computational Electromagnetics (ACE)
Dupont, François ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Laurent, Philippe ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Redouté, Jean-Michel  ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Language :
English
Title :
Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor
Publication date :
05 January 2022
Event name :
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Event organizer :
IEEE
Event place :
Singapore, Singapore
Event date :
from 7-12-2021 to 9-12-2021
Audience :
International
Main work title :
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Publisher :
IEEE
Peer reviewed :
Peer reviewed
Name of the research project :
Microsystème_ULg Microsys and Socle_ULgMicrosys projects, Micro+ project
Funders :
The work was supported by the Microsystème_ULg Microsys and Socle_ULgMicrosys projects, funded by the Wallonia (Belgium), and the Micro+ project cofounded by the European Regional Development Fund (ERDF) and Wallonia (Belgium).
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since 13 January 2022

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