Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor

[en] Following a demand for thermal management there is need to measure precisely a temperature on the most critical part of microassembly. The widely-used contact type of measurements is often not suitable for micro parts of assembly as small as 0.5 mm and smaller. The non-contact measurements currently available are not always directly applicable on complex heterogeneous microassemblies structures such as miniaturized metal-oxide (MOX) gas sensor. In response to this, we have developed a simple technique using IR thermography for accurate and non-contact temperature measurements of electronic microassemblies, and validate this approach with MOX sensors heated to operating temperature of 250-300°C.

Disciplines :

Electrical & electronics engineering

Author, co-author :

Stoukatch, Serguei ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Fagnard, Jean-François ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Applied and Computational Electromagnetics (ACE)

Dupont, François ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Laurent, Philippe ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Redouté, Jean-Michel ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Language :

English

Title :

Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor

Publication date :

05 January 2022

Event name :

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

Event organizer :

IEEE

Event place :

Singapore, Singapore

Event date :

from 7-12-2021 to 9-12-2021

Audience :

International

Main work title :

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

Publisher :

IEEE

Peer reviewed :

Peer reviewed

Additional URL :

https://ieeexplore.ieee.org/abstract/document/9663945/keywords#keywords

Name of the research project :

Microsystème_ULg Microsys and Socle_ULgMicrosys projects, Micro+ project

Funders :

The work was supported by the Microsystème_ULg Microsys and Socle_ULgMicrosys projects, funded by the Wallonia (Belgium), and the Micro+ project cofounded by the European Regional Development Fund (ERDF) and Wallonia (Belgium).

Available on ORBi :

since 13 January 2022

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