Abstract :
[en] Following a demand for thermal management there is need to measure precisely a temperature on the most critical part of microassembly. The widely-used contact type of measurements is often not suitable for micro parts of assembly as small as 0.5 mm and smaller. The non-contact measurements currently available are not always directly applicable on complex heterogeneous microassemblies structures such as miniaturized metal-oxide (MOX) gas sensor. In response to this, we have developed a simple technique using IR thermography for accurate and non-contact temperature measurements of electronic microassemblies, and validate this approach with MOX sensors heated to operating temperature of 250-300°C.
Name of the research project :
Microsystème_ULg Microsys and Socle_ULgMicrosys projects, Micro+ project
Funders :
The work was supported by the Microsystème_ULg Microsys and Socle_ULgMicrosys projects, funded by the Wallonia (Belgium), and the Micro+ project cofounded by the European Regional Development Fund (ERDF) and Wallonia (Belgium).
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