Reference : Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor
Scientific congresses and symposiums : Paper published in a book
Engineering, computing & technology : Electrical & electronics engineering
http://hdl.handle.net/2268/267020
Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor
English
Stoukatch, Serguei mailto [Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés >]
Fagnard, Jean-François mailto [Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Applied and Computational Electromagnetics (ACE) >]
Dupont, François mailto [Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés >]
Laurent, Philippe mailto [Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés >]
Redouté, Jean-Michel mailto [Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés >]
5-Jan-2022
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
IEEE
Yes
No
International
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
from 7-12-2021 to 9-12-2021
IEEE
Singapore
Singapore
[en] Non-contact thermal characterization ; IR thermography ; MOX sensors ; thermal management of electronic packaging ; microassembly
[en] Following a demand for thermal management there is need to measure precisely a temperature on the most critical part of microassembly. The widely-used contact type of measurements is often not suitable for micro parts of assembly as small as 0.5 mm and smaller. The non-contact measurements currently available are not always directly applicable on complex heterogeneous microassemblies structures such as miniaturized metal-oxide (MOX) gas sensor. In response to this, we have developed a simple technique using IR thermography for accurate and non-contact temperature measurements of electronic microassemblies, and validate this approach with MOX sensors heated to operating temperature of 250-300°C.
The work was supported by the Microsystème_ULg Microsys and Socle_ULgMicrosys projects, funded by the Wallonia (Belgium), and the Micro+ project cofounded by the European Regional Development Fund (ERDF) and Wallonia (Belgium).
Microsystème_ULg Microsys and Socle_ULgMicrosys projects, Micro+ project
Researchers ; Professionals ; Students
http://hdl.handle.net/2268/267020
10.1109/EPTC53413.2021.9663945
https://ieeexplore.ieee.org/abstract/document/9663945/keywords#keywords
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