Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB

Stoukatch, Serguei; André, Nicolas; Delhaye, Thibault; Dupont, François; Redouté, Jean-Michel; Flandre, Denis

doi:10.1109/SENSORS47125.2020.9278669

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Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB

Stoukatch, Serguei; André, Nicolas; Delhaye, Thibault et al.

2020 • In Proceedings of IEEE Sensors, p. 1-4

Peer reviewed

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https://hdl.handle.net/2268/256428

DOI
10.1109/SENSORS47125.2020.9278669

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Keywords :

low-cost flip-chip assembly; anisotropic conductive films; sensors assembly on flex; assembly methods for prototypes

Abstract :

[en] We developed a low-cost process for assembling versatile sensors without expensive, thick metal finish on rigid and flexible PCB using anisotropic conductive films (ACF) flip-chip (FC) process. This allows a lower temperature budget than conventional FC assembly. The ACF FC process requires no expensive set up, is quick to implement and suits perfectly for sensor prototyping and low-scale manufacturing. The process was directly applied to assemble the bare die of a CMOS strain gauge sensor on flexible PCB without compromising its integrity.

Disciplines :

Electrical & electronics engineering

Author, co-author :

Stoukatch, Serguei ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

André, Nicolas; Université Catholique de Louvain

Delhaye, Thibault; Université Catholique de Louvain

Dupont, François ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Redouté, Jean-Michel ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Flandre, Denis; Université Catholique de Louvain

Language :

English

Title :

Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB

Publication date :

25 October 2020

Event name :

2020 IEEE Sensors

Event organizer :

IEEE

Event place :

Rotterdam, Netherlands

Event date :

25-28 Oct. 2020

Audience :

International

Journal title :

Proceedings of IEEE Sensors

ISSN :

1930-0395

eISSN :

2168-9229

Publisher :

IEEE

Special issue title :

2020 IEEE Sensors

Pages :

1-4

Peer reviewed :

Peer reviewed

Additional URL :

https://ieeexplore.ieee.org/abstract/document/9278669

Name of the research project :

Micro+

Funders :

Wallonia
FEDER - Fonds Européen de Développement Régional

Available on ORBi :

since 03 February 2021

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