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A review on carbon based materials as on-chip interconnects
Sadeghi, Hatef; Redouté, Jean-Michel; Lai, Daniel T. H. et al.
2011In Proceedings of SPIE: The International Society for Optical Engineering, 8204
Peer reviewed
 

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Keywords :
BGN; Carbon based materials; CNT; Conductance; GNR; Graphene; Interconnects; Model; Multilayer graphene; TGN; Electric conductance; Electric properties; Interconnection networks; Models; Optical interconnects; Materials
Abstract :
[en] Interconnect wires are major technology components of modern high-speed integrated circuits. To overcome the latter's degradation caused by increasing miniaturization, there is an urgent need to look for alternative technologies. Since carbon based materials generate promising results, this paper focuses on describing the electrical properties of carbon based materials, in particular the use of graphene nanoribbon (GNR) as well as trilayer graphene nanoribbon (TGN) as next generation interconnects: since the conductance of TGN is less affected by external fields compared to GNR, it forms an improved choice for on-chip interconnects. The conductance model of TGN is derived and discussed in detail. © 2011 SPIE.
Disciplines :
Electrical & electronics engineering
Author, co-author :
Sadeghi, Hatef;  Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Skudai, Johor, Malaysia
Redouté, Jean-Michel  ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Lai, Daniel T. H.;  School of Engineering and Science, Victoria University, Melbourne VIC 8001, Australia
Ahmadi, M. T.;  Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Skudai, Johor, Malaysia
Ismail, Razali;  Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Skudai, Johor, Malaysia
Language :
English
Title :
A review on carbon based materials as on-chip interconnects
Publication date :
2011
Event name :
Smart Nano-Micro Materials and Devices
Event date :
5 December 2011 through 7 December 2011
Audience :
International
Journal title :
Proceedings of SPIE: The International Society for Optical Engineering
ISSN :
0277-786X
eISSN :
1996-756X
Publisher :
International Society for Optical Engineering, Bellingham, United States - Washington
Volume :
8204
Peer reviewed :
Peer reviewed
Funders :
Swinburne University of Technology [AU]
Commentary :
88102 9780819488459
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since 01 April 2020

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