Reference : A review on carbon based materials as on-chip interconnects
Scientific congresses and symposiums : Paper published in a journal
Engineering, computing & technology : Electrical & electronics engineering
http://hdl.handle.net/2268/246353
A review on carbon based materials as on-chip interconnects
English
Sadeghi, Hatef [Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Skudai, Johor, Malaysia]
Redouté, Jean-Michel mailto [Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés >]
Lai, Daniel T. H. [School of Engineering and Science, Victoria University, Melbourne VIC 8001, Australia]
Ahmadi, M. T. [Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Skudai, Johor, Malaysia]
Ismail, Razali [Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Skudai, Johor, Malaysia]
2011
Proceedings of SPIE: The International Society for Optical Engineering
8204
Yes
International
0277-786X
1996-756X
Smart Nano-Micro Materials and Devices
5 December 2011 through 7 December 2011
Hawthorn, VIC
[en] BGN ; Carbon based materials ; CNT ; Conductance ; GNR ; Graphene ; Interconnects ; Model ; Multilayer graphene ; TGN ; Electric conductance ; Electric properties ; Interconnection networks ; Models ; Optical interconnects ; Materials
[en] Interconnect wires are major technology components of modern high-speed integrated circuits. To overcome the latter's degradation caused by increasing miniaturization, there is an urgent need to look for alternative technologies. Since carbon based materials generate promising results, this paper focuses on describing the electrical properties of carbon based materials, in particular the use of graphene nanoribbon (GNR) as well as trilayer graphene nanoribbon (TGN) as next generation interconnects: since the conductance of TGN is less affected by external fields compared to GNR, it forms an improved choice for on-chip interconnects. The conductance model of TGN is derived and discussed in detail. © 2011 SPIE.
Swinburne University of Technology
http://hdl.handle.net/2268/246353
10.1117/12.903196
88102
9780819488459

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