A review on carbon based materials as on-chip interconnects

BGN; Carbon based materials; CNT; Conductance; GNR; Graphene; Interconnects; Model; Multilayer graphene; TGN; Electric conductance; Electric properties; Interconnection networks; Models; Optical interconnects; Materials

Abstract :

[en] Interconnect wires are major technology components of modern high-speed integrated circuits. To overcome the latter's degradation caused by increasing miniaturization, there is an urgent need to look for alternative technologies. Since carbon based materials generate promising results, this paper focuses on describing the electrical properties of carbon based materials, in particular the use of graphene nanoribbon (GNR) as well as trilayer graphene nanoribbon (TGN) as next generation interconnects: since the conductance of TGN is less affected by external fields compared to GNR, it forms an improved choice for on-chip interconnects. The conductance model of TGN is derived and discussed in detail. © 2011 SPIE.

Disciplines :

Electrical & electronics engineering

Author, co-author :

Sadeghi, Hatef; Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Skudai, Johor, Malaysia

Redouté, Jean-Michel ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Lai, Daniel T. H.; School of Engineering and Science, Victoria University, Melbourne VIC 8001, Australia

Ahmadi, M. T.; Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Skudai, Johor, Malaysia

Ismail, Razali; Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Skudai, Johor, Malaysia

Language :

English

Title :

A review on carbon based materials as on-chip interconnects

Publication date :

2011

Event name :

Smart Nano-Micro Materials and Devices

Event date :

5 December 2011 through 7 December 2011

Audience :

International

Journal title :

Proceedings of SPIE: The International Society for Optical Engineering

ISSN :

0277-786X

eISSN :

1996-756X

Publisher :

International Society for Optical Engineering, Bellingham, United States - Washington

Volume :

8204

Peer reviewed :

Peer reviewed

Funders :

Swinburne University of Technology

Commentary :

88102 9780819488459

Available on ORBi :

since 01 April 2020

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