S. Mishra and V. Yadava, Laser beam micromachining (LBMM) - a review, Opt Lasers Eng, vol. 73, pp. 89–122, 2015.
C.P. Wang, C.P. Chou, T.L. Chang, and C.Y. Chou, Micromachining of graphene based micro-capacitor using picosecond laser ablation, Microelectron Eng, vol. 189, pp. 69–73, 2018.
S. Prakash and S. Kumar, Microchannel fabrication via direct laser writing, no. 1. Elsevier Ltd, 2016.
J. Lin et al., Fabrication of high-Q lithium niobate microresonators using femtosecond laser micromachining, Sci Rep, vol. 5, no. 4, pp. 4–7, 2015.
W. Watanabe, Y. Li, and K. Itoh, [INVITED] ultrafast laser micro-processing of transparent material, Opt Laser Technol, vol. 78, pp. 52–61, 2016.
K. Rahim and A. Mian, A review on laser processing in electronic and mems packaging, J Electron Packag, vol. 139, no. 3, p. 030801, 2017.
D. Ball, Thoughts on undercut. [Online]. Available: http://www.chemcut.net/wp-content/uploads/2015/03/Chemcut_Thoughts_on_Undercut.pdf. [Accessed: 04-Jun-2019].
O. Cakir, Copper etching with cupric chloride and regeneration of waste etchant, J Mater Process Technol, vol. 175, pp. 63–68, 2006.
Nitto, High density and precision flexible printed circuit. [Online]. Available: https://www.nitto.com/eu/en/products/group/flexible/001/. [Accessed: 05-Apr-2019].
ElectronicDesign, mSAP: the new PCB manufacturing imperative for 5G SMartphones.” [Online]. Available: https://www.electronicdesign.com/industrial-automation/msap-new-pcb-manufacturing-imperative-5g-smartphones. [Accessed: 05-Apr-2019].
LPKF, PCB structuring, the faster way to create circuit boards. [Online]. Available: https://www.lpkf.com/en/industries-technologies/research-in-house-pcb-prototyping/pcb-structuring/. [Accessed: 06-Sep-2019].
F. Dupont, S. Stoukatch, P. Laurent, S. Dricot, and M. Kraft, 355nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration, Opt Lasers Eng, vol. 100, pp. 186–194, 2018.
D. Ulieru, A. Matei, E. Ulieru, A. Tantau, and F. Babarada, High density interconnections fabrication by UV lasers microprocessing of microvias and microstructures, in Proceedings of the international conference multi-material micro manufacture 4M2008, 2008, pp. 73–77.
F. Zhang, J. Duan, X. Zeng, and X. Li, 355nm DPSS UV laser micro-processing for the semiconductor and electronics industry, Proc SPIE - Int Soc Opt Eng, vol. 7584, pp. 1–10, 2010.
M.N. Polyanskiy, Refractive index database. [Online]. Available: https://refractiveindex.info/. [Accessed: 05-Apr-2019].
E.T. Arakawa, M.W. Williams, J.C. Ashley, and L.R. Painter, The optical properties of Kapton: measurement and applications, J Appl Phys, vol. 52, no. 5, pp. 3579–3582, 1981.
F. Aloui, L. Lecamp, P. Lebaudy, and F. Burel, Photopolymerization of an epoxy resin: conversion and temperature dependence of its refractive index, Macromol Chem Phys, vol. 217, no. 18, pp. 2063–2067, 2016.
H. Durmus, H. Safak, H.Z. Akbas, and G. Ahmetli, Optical properties of modified epoxy resin with various oxime derivatives in the UV-VIS spectral region, J Appl Polym Sci, vol. 120, no. 3, pp. 1490–1495, 2011.
Goodfellow, Material properties goodfellow catalogue. [Online]. Available: http://www.goodfellow.com/catalogue/GFCat2C.php?ewd_token=6OocmOpoWh81PYim8WlNc3CffRdaAq&n=7HVeEWCKEDLW29oijfEo8cMQcLNLn9&ewd_urlNo=GFCat26&type=30&prop=2. [Accessed: 05-Apr-2019].
G. R. Liu Y.S., Cole H.S., Philipp H.R., Photoetching of polymers with excimer lasers, Lasers Microlithogr, vol. 774, pp. 4057–4060, 1987.
W.K. Yung, J. Liu, H. Man, and T. Yue, 355nm Nd:YAG laser ablation of polyimide and its thermal effect, J Mater Process Technol, vol. 101, no. 1–3, pp. 306–311, 2000.
F. Zhang, X. Zeng, X. Li, and J. Duan, A study of laser etching and cutting PCB boards by 355nm DPSS UV laser, in Proceedings of the Pacific international conference on application of lasers and optics, 2018, pp. 880–884.
W. Lei and J. Davignon, Micro-via drilling applications with solid-state harmonic UV laser systems, in Proceedings of the international congress on applications of lasers & electro-optics, 2003.
R. Schaeffer, Fundamentals of laser micromachining. Taylor & Francis, 2016.
H.A. Wheeler, Simple inductance formula for radio coils, vol. 16, no. 10, pp. 1398–1400, 1928.
A.V. Quintero, D. Briand, and N.F. De Rooij, Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist, J Micromech Microeng, vol. 25, no. 4, 2015.
Y.Y. Chen, J.G. Duh, and B.S. Chiou, The effect of substrate surface roughness on the wettability of Sn-Bi solders, J Mater Sci Mater Electron, vol. 11, no. 4, pp. 279–283, 2000.
