Abstract :
[en] The paper reports on assembly and integration of MS (microsystems) into fully functional system. We show that among varieties of assembly techniques and methods commonly used for IC, some can be successfully used also for the assembly of microsystems. MS are specifically sensitive to thermal exposure that can occur during the assembly and integration process.
Commentary :
In the paper we have demonstrated that the thermal sensitive MS die can be assembled using carefully selected and adapted conventional assembly techniques without compromising MS die mechanical integrity. For the adhesive curing, we used lower than a conventional curing temperature, for the wire bonding we utilized room temperature Al wire bonding process. As a criteria for MS die mechanical integrity we introduced methods where we observed only four sensitive areas on the die. Such areas are more sensitive to thermal impact as an actual comb structures and are easy to observe and to quantify.
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