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Development of an implantable integrated MEMS pressure sensor using polyimide epoxy composite and Atomic Layer Deposition for encapsulation
Gembaczka, P; Görtz, M; Kraft, Michael
2014In Proceedings of "48th DGBMT Annual Conf. : Hannover, Germany Octobre 2014"
Peer reviewed
 

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Disciplines :
Electrical & electronics engineering
Author, co-author :
Gembaczka, P
Görtz, M
Kraft, Michael ;  Université de Liège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Language :
English
Title :
Development of an implantable integrated MEMS pressure sensor using polyimide epoxy composite and Atomic Layer Deposition for encapsulation
Publication date :
October 2014
Event name :
48th DGBMT Annual Conference
Event place :
Hannover, Germany
Event date :
Octobre 2014
Audience :
International
Main work title :
Proceedings of "48th DGBMT Annual Conf. : Hannover, Germany Octobre 2014"
Peer reviewed :
Peer reviewed
Available on ORBi :
since 30 June 2015

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