Development of an implantable integrated MEMS pressure sensor using polyimide epoxy composite and Atomic Layer Deposition for encapsulation

No full text

Paper published in a book (Scientific congresses and symposiums)

Gembaczka, P; Görtz, M; Kraft, Michael

2014 • In Proceedings of "48th DGBMT Annual Conf. : Hannover, Germany Octobre 2014"

Peer reviewed

Permalink
https://hdl.handle.net/2268/183404

No document available.

Disciplines :

Electrical & electronics engineering

Author, co-author :

Gembaczka, P

Görtz, M

Kraft, Michael ; Université de Liège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Language :

English

Title :

Development of an implantable integrated MEMS pressure sensor using polyimide epoxy composite and Atomic Layer Deposition for encapsulation

Publication date :

October 2014

Event name :

48th DGBMT Annual Conference

Event place :

Hannover, Germany

Event date :

Octobre 2014

Audience :

International

Main work title :

Proceedings of "48th DGBMT Annual Conf. : Hannover, Germany Octobre 2014"

Peer reviewed :

Peer reviewed

Available on ORBi :

since 30 June 2015

Number of views

83 (1 by ULiège)

Number of downloads

0 (0 by ULiège)