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Low temperature assembly method of microfluidic bio-molecules detection device
Van Loo, Stéphanie; Stoukatch, Serguei; Van Overstraeten-Schlögel, Nancy et al.
2012In Suga, Tadatomo; Takagi, Hideki; Higurashi, Heiji (Eds.) 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012)
 

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Keywords :
bio-packaging; microfluidics; low temperature assembly; biocompatibility
Abstract :
[en] We developed a microfluidic device for the detection of bio-molecules. The active part of the device is a biofunctionalized interdigitated capacitive sensor. The microsystem consists of a sensor on silicon chip, a microfluidic channel formed by photo-patternable resist and a plastic cover. We implemented a low temperature packaging process to assemble the sensor and prevent the biological material from degradation.
Disciplines :
Electrical & electronics engineering
Engineering, computing & technology: Multidisciplinary, general & others
Author, co-author :
Van Loo, Stéphanie ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Electronique, microsystèmes, mesures et instrumentation
Stoukatch, Serguei  ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Electronique, microsystèmes, mesures et instrumentation
Van Overstraeten-Schlögel, Nancy;  Université Catholique de Louvain - UCL > ICTEAM > DICE
Lefèvre, Olivia;  Coris BioConcept
Axisa, Fabrice ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Electronique, microsystèmes, mesures et instrumentation
Flandre, Denis;  Université Catholique de Louvain - UCL > ICTEAM > DICE
Mertens, Pascal;  Coris BioConcept
Destiné, Jacques ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Electronique, microsystèmes, mesures et instrumentation
Language :
English
Title :
Low temperature assembly method of microfluidic bio-molecules detection device
Publication date :
22 May 2012
Event name :
3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012)
Event organizer :
Professor Dr. Tadatomo Suga, The Univeristy of Tokyo
Event place :
Tokyo, Hongo, Japan
Event date :
May 22-23, 2012
Audience :
International
Main work title :
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012)
Editor :
Suga, Tadatomo
Takagi, Hideki
Higurashi, Heiji
Publisher :
IEEE, Tokyo, Japan
ISBN/EAN :
978-1-4673-0740-6
Pages :
181-184
Name of the research project :
DNASiP
Commentary :
Best Presentation & Paper award
Available on ORBi :
since 18 June 2012

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