Dupont, F., Stoukatch, S., Laurent, P., Eersels, K., van Grinsven, B., & Redouté, J.-M. (19 March 2024). Design Aspects for Portable LED-Based Colorimetric Characterisation Systems Targeting Liquid Analytes. Sensors, 24 (6), 1960. doi:10.3390/s24061960 |
Stoukatch, S., Debliquy, M., Dupont, F., & Redouté, J.-M. (30 November 2023). Low-Cost Optical pH Sensor with a Polyaniline (PANI)-Sensitive Layer Based on Commercial Off-the-Shelf (COTS) Components. Micromachines, 14 (12), 2197. doi:10.3390/mi14122197 |
Stoukatch, S., Dupont, F., Laurent, P., & Redouté, J.-M. (14 September 2023). Package Design Thermal Optimization for Metal-Oxide Gas Sensors by Finite Element Modeling and Infra-Red Imaging Characterization. Materials, 16 (18), 6202. doi:10.3390/ma16186202 |
Stoukatch, S., Dupont, F., & Redouté, J.-M. (2022). Device Processing Challenges for Miniaturized Sensing Systems Targeting Biological Fluids. Biomedical Materials and Devices. doi:10.1007/s44174-022-00034-z |
Stoukatch, S., Fagnard, J.-F., Roy, G., Laurent, P., Dupont, F., Jacques, P. J., & Redouté, J.-M. (2022). Thermal conductivity characterization of an in-house formulated thermal insulating xerogel - epoxy composite adhesive for electronics applications. IEEE Xplore, 315-320. doi:10.1109/estc55720.2022.9939477 |
Dupont, F., Laurent, P., Montfort, F., Pierre, H., Jeanne, L., Stoukatch, S., Dricot, S., & Redouté, J.-M. (March 2022). A Miniaturized and Ultra-Low-Power Tamper Detection Sensor for Portable Applications. IEEE Sensors Journal, 22 (5), 4524 - 4533. doi:10.1109/JSEN.2022.3143656 |
Stoukatch, S., Fagnard, J.-F., Dupont, F., Laurent, P., Debliquy, M., & Redouté, J.-M. (26 February 2022). Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors. IEEE Access, 10, 19242-19253. doi:10.1109/ACCESS.2022.3151356 |
Stoukatch, S., Fagnard, J.-F., Dupont, F., Laurent, P., & Redouté, J.-M. (2022). Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor. In 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). IEEE. doi:10.1109/EPTC53413.2021.9663945 |
Stoukatch, S., Nicolas, A., Dupont, F., Redouté, J.-M., & Flandre, D. (2021). Ultra-Thinned Individual SOI Die ACF FC Bonded on Rigid and Flex PCB. In 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE. doi:10.23919/EMPC53418.2021.9584947 |
Fagnard, J.-F., Stoukatch, S., Laurent, P., Dupont, F., Wolfs, C., Lambert, S., & Redouté, J.-M. (April 2021). Preparation and characterization of a thermal insulating carbon xerogel-epoxy composite adhesive for electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (4), 606-615. doi:10.1109/TCPMT.2021.3059478 |
Stoukatch, S., Francis, L., Dupont, F., & Kraft, M. (March 2021). Low-cost microfluidic device micromachining and sequential integration with SAW sensor intended for biomedical applications. IEEE Sensors Journal, Volume 319. doi:10.1016/j.sna.2020.112526 |
Wang, Y., Liu, H., Wang, C., Zhao, C., Redouté, J.-M., Stoukatch, S., Xiao, Q., Tu, L., & Kraft, M. (2021). Towards a Hybrid Mass Sensing System by Combining a QCM Mass Sensor with a 3-DOF Mode Localized Coupled Resonator Stiffness Sensor. IEEE Sensors Journal. doi:10.1109/JSEN.2021.3052046 |
Stoukatch, S., André, N., Delhaye, T., Dupont, F., Redouté, J.-M., & Flandre, D. (2020). Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB. Proceedings of IEEE Sensors, 1-4. doi:10.1109/SENSORS47125.2020.9278669 |
Dupont, F., Stoukatch, S., Laurent, P., & Redouté, J.-M. (2020). Fine pitch features laser direct patterning on flexible printed circuit board. Optics and Lasers in Engineering. doi:10.1016/j.optlaseng.2019.105869 |
Joris, L., Dupont, F., Laurent, P., Bellier, P., Stoukatch, S., & Redouté, J.-M. (2019). An Autonomous Sigfox Wireless Sensor Node for Environmental Monitoring. IEEE Sensors Letters, 3 (7), 1-4. doi:10.1109/LSENS.2019.2924058 |
Stoukatch, S., Dupont, F., & Kraft, M. (2018). Low-temperature Packaging Methods as a Key Enablers for Microsystems Assembly and Integration. International Semiconductor Conference. Proceedings. doi:10.1109/SMICND.2018.8539847 |
Stoukatch, S., Dupont, F., Seronveaux, L., Vandormael, D., & Kraft, M. (2018). Additive low temperature 3D printed electronic as enabling technology for IoT application. Electronics Packaging Technology Conference (EPTC). doi:10.1109/EPTC.2017.8277554 |
Bellier, P., Laurent, P., Stoukatch, S., Dupont, F., Joris, L., & Kraft, M. (2018). Autonomous micro-platform for multisensors with an advanced power management unit (PMU). Journal of Sensors and Sensor Systems, 7 (1), 299-308. doi:10.5194/jsss-7-299-2018 |
Dupont, F., Stoukatch, S., Laurent, P., Dricot, S., & Kraft, M. (January 2018). 355nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration. Optics and Lasers in Engineering, 100, 186-194. doi:10.1016/j.optlaseng.2017.08.014 |
Laurent, P., Stoukatch, S., Dupont, F., & Kraft, M. (2018). Electrical characterization of Aerosol Jet Printing (AJP) deposited conductive silver tracks on organic materials. Microelectronic Engineering, 197, 67-75. doi:10.1016/j.mee.2018.06.002 |
Colson, G., Laurent, P., Bellier, P., Stoukatch, S., Dupont, F., & Kraft, M. (10 May 2017). Smart-shoes self-powered by walking [Poster presentation]. Body sensor networks, Eindhoven, Netherlands. |
Van Loo, S., Stoukatch, S., Kraft, M., & Gilet, T. (12 October 2016). Droplet formation by squeezing in a microfluidic cross-junction. Microfluidics and Nanofluidics, 20 (10), 1-12. doi:10.1007/s10404-016-1807-1 |
Van Loo, S., Stoukatch, S., Kraft, M., & Gilet, T. (07 September 2016). How do droplets form? [Poster presentation]. 1st International Conference on Multiscale Applications of Surface Tension, Bruxelles, Belgium. |
Stoukatch, S. (2016). Chapter 2. Low-Temperature Microassembly Methods and Integration Techniques for Biomedical Applications. In P. Salvo & M. Hernandez-Silveira (Eds.), Wireless Medical Systems and Algorithms (pp. 21-42). CRC Press 2016. |
Darbois-Texier, B., Laurent, P., Stoukatch, S., & Dorbolo, S. (2016). wicking through a confined micropillar array. Microfluidics and Nanofluidics, 20, 53. doi:10.1007/s10404-016-1724-3 |
Laurent, P., Dupont, F., Stoukatch, S., & Axisa, F. (2015). Ultra-low power microsystems integrated. In 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems 2015. Mesago Messe Frankfurt GmbH. |
Van Loo, S., Stoukatch, S., & Gilet, T. (July 2014). Droplet synchronization in multiple interconnected parallel channels [Poster presentation]. EMBL Microfluidics 2014, Heidelberg, Germany. |
Stoukatch, S., Léonard, J., Bellier, P., Axisa, F., & Destiné, J. (2014). Wearable respiratory belt for human breathing control. In Conf. Proc. Smart Systems Integration Conf. (SSI2014). |
Laurent, P., Stoukatch, S., Maillard, N., Axisa, F., & Destiné, J. (18 October 2013). Autonomous Micro-platform for Multi-sensors (AMM) for wireless monitoring [Paper presentation]. 1st WINFAB SCIENTIFIC DAY, Louvain-la-Neuve, Belgium. |
Laurent, P., Stoukatch, S., Maillard, N., Axisa, F., & Destiné, J. (18 October 2013). Autonomous Micro-platform for Multi-sensors (AMM) [Paper presentation]. 1st WINFAB SCIENTIFIC DAY, Louvain-la-Neuve, Belgium. |
Laurent, P., Stoukatch, S., Maillard, N., & Axisa, F. (13 June 2013). Autonomous Micro-platform for Multi-sensors integration and wireless monitoring [Paper presentation]. Cohesi Community Work-shop, "From Electronic Building Blocks to Innovative Microsystems", Leuven, Belgium. |
Stoukatch, S., Walewyns, T., Tooten, E., & Francis, L. (2013). Chemically resistant encapsulant to enable a novel MEMS fabrication process. In Conf. Proceedings. |
Saint-Mard, M., Stoukatch, S., Schischke, K., Laurent, P., Heusdens, B., Xhonneux, T., Maillard, N., Axisa, F., & Destiné, J. (2013). Innovative smart sensors to enhance eco-efficiency of a continuous (steel) production line. In Proc. Conf. of the AMA Association for Sensor Technology. |
Stoukatch, S., Seronveaux, L., Laurent, P., Dricot, S., Axisa, F., Vandormael, D., Beeckman, E., Heusdens, B., & Destiné, J. (18 September 2012). Evaluation of aerosol jet printing (AJP) technology for electronic packaging and interconnect technique [Paper presentation]. Proc. The 4th Electronics System Integration Technology Conferences (ESTC 2012), Amsterdam, Netherlands. doi:10.1109/ESTC.2012.6542067 |
Van Loo, S., Stoukatch, S., Van Overstraeten-Schlögel, N., Lefèvre, O., Axisa, F., Flandre, D., Mertens, P., & Destiné, J. (2012). Low temperature assembly method of microfluidic bio-molecules detection device. In T. Suga, H. Takagi, ... H. Higurashi (Eds.), 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012) (pp. 181-184). Tokyo, Japan: IEEE. doi:10.1109/LTB-3D.2012.6238086 |
Saint-Mard, M., & Stoukatch, S. (27 March 2012). MEMS packaging is crucial for system performance and reliability [Paper presentation]. The Microsystem design flow: From layout to Packaging, Liege, Belgium. |
Stoukatch, S., Tooten, E., Axisa, F., Heusdens, B., Francis, L., & Destiné, J. (21 March 2012). Chemically resistant encapsulation for MEMS release [Paper presentation]. Smart Systems Integration 2012. |
Overstraeten-Schlögel, N., Dupuis, P., Lefévre, O., Stoukatch, S., Van Loo, S., & Flandre, D. (02 December 2011). Immununoassay using a biofunctionnalized alumina-coated capacitive biosensor: towards a microfluidic detection of the h5n1 influenza virus [Paper presentation]. 10th National Day on Biomedical engineering and Annual symposium of the IEEE EMBS Benelux Chapter, Gent, Belgium. |
van Overstraten-Schlogel, N., Depuis, P., Lefévre, O., Stoukatch, S., Van Loo, S., & Flandre, D. (02 December 2011). Immunoassay using a biofunctionnalized alumina-coated capacitive biosensor: towards a microfluidic detection of the H5N1 Influenza virus [Poster presentation]. 10th National Day on Biomedical engineering and Annual symposium of the IEEE EMBS Benelux Chapter. |
Axisa, F., & Stoukatch, S. (24 November 2011). Microsys lab: R&D in the field of Microsystem and Packaging technology [Paper presentation]. Cohesi Community Work-shop, Leuven, Belgium. |
Overstraeten-Schlögel, N., Dupuis, P., Lefévre, O., Stoukatch, S., Van Loo, S., & Flandre, D. (12 October 2011). Immunoassay using a biofunctionnalized alumina-coated capacitive biosensor: towards a microfluidic detection of the H5N1 Influenza virus [Paper presentation]. 2nd International Conf. on Bio-sensing Technology (BITE2011), Amsterdam, Netherlands. |
Stoukatch, S., Van Overstraeten-Schlögel, N., Van Loo, S., Axisa, F., Heusdens, B., Destiné, J., & Flandre, D. (11 October 2011). Method of assembly of capacitive bio-sensor for bio-molecules detection [Paper presentation]. Plastic Electronics Conference and Exhibition (PE2011), Dresden, Germany. |
Stoukatch, S., & Saint-Mard, M. (18 March 2010). IC and Microsystem Micro-assembly and Packaging [Paper presentation]. Technical event on IC and Microsystem Micro Packaging, Liege, Belgium. |
Saint-Mard, M., Heusdens, B., Stoukatch, S., & Destiné, J. (March 2010). Micro-multi-sensor platform for industrial processes monitoring [Poster presentation]. Smart Systems Integration, Come, Italy. |