Dupont, F., Stoukatch, S., Laurent, P., Eersels, K., van Grinsven, B., & Redouté, J.-M. (19 March 2024). Design Aspects for Portable LED-Based Colorimetric Characterisation Systems Targeting Liquid Analytes. Sensors, 24 (6), 1960. doi:10.3390/s24061960 |
Stoukatch, S., Debliquy, M., Dupont, F., & Redouté, J.-M. (30 November 2023). Low-Cost Optical pH Sensor with a Polyaniline (PANI)-Sensitive Layer Based on Commercial Off-the-Shelf (COTS) Components. Micromachines, 14 (12), 2197. doi:10.3390/mi14122197 |
Gayon, L., Dubois, R., Laurent, P., Bellier, P., Dupont, F., Manto, V., & Andrianne, T. (27 September 2023). Aeroelastic measurements on a vertical axis wind turbine [Paper presentation]. 16th International Conference on Wind Engineering - ICWE16, Italy. |
Stoukatch, S., Dupont, F., Laurent, P., & Redouté, J.-M. (14 September 2023). Package Design Thermal Optimization for Metal-Oxide Gas Sensors by Finite Element Modeling and Infra-Red Imaging Characterization. Materials, 16 (18), 6202. doi:10.3390/ma16186202 |
Bellier, P., Coppieters 't Wallant D., Van den Bongarth H., Bijnens W., Aarts J., Vandenryt T., Thoelen R., Duflot, P., Dupont, F., & Redouté, J.-M. (2023). A Wireless Low-power Single-unit Wearable System for Continuous Early Warning Score Calculation. IEEE Sensors Journal, 23 (11), 12171-12180. doi:10.1109/JSEN.2023.3267146 |
Stoukatch, S., Dupont, F., & Redouté, J.-M. (2022). Device Processing Challenges for Miniaturized Sensing Systems Targeting Biological Fluids. Biomedical Materials and Devices. doi:10.1007/s44174-022-00034-z |
Stoukatch, S., Fagnard, J.-F., Roy, G., Laurent, P., Dupont, F., Jacques, P. J., & Redouté, J.-M. (2022). Thermal conductivity characterization of an in-house formulated thermal insulating xerogel - epoxy composite adhesive for electronics applications. IEEE Xplore, 315-320. doi:10.1109/estc55720.2022.9939477 |
Dupont, F., Laurent, P., Montfort, F., Pierre, H., Jeanne, L., Stoukatch, S., Dricot, S., & Redouté, J.-M. (March 2022). A Miniaturized and Ultra-Low-Power Tamper Detection Sensor for Portable Applications. IEEE Sensors Journal, 22 (5), 4524 - 4533. doi:10.1109/JSEN.2022.3143656 |
Stoukatch, S., Fagnard, J.-F., Dupont, F., Laurent, P., Debliquy, M., & Redouté, J.-M. (26 February 2022). Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors. IEEE Access, 10, 19242-19253. doi:10.1109/ACCESS.2022.3151356 |
Stoukatch, S., Fagnard, J.-F., Dupont, F., Laurent, P., & Redouté, J.-M. (2022). Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor. In 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). IEEE. doi:10.1109/EPTC53413.2021.9663945 |
Laurent, P., Fagnard, J.-F., Dupont, F., & Redouté, J.-M. (2022). Optimization of the Power Flow Generated by an AC Energy Harvester for Variable Operating Conditions. IEEE Transactions on Circuits and Systems I: Regular Papers, 69 (6), 2625 - 2636. doi:10.1109/TCSI.2022.3156691 |
Stoukatch, S., Nicolas, A., Dupont, F., Redouté, J.-M., & Flandre, D. (2021). Ultra-Thinned Individual SOI Die ACF FC Bonded on Rigid and Flex PCB. In 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE. doi:10.23919/EMPC53418.2021.9584947 |
Fagnard, J.-F., Stoukatch, S., Laurent, P., Dupont, F., Wolfs, C., Lambert, S., & Redouté, J.-M. (April 2021). Preparation and characterization of a thermal insulating carbon xerogel-epoxy composite adhesive for electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (4), 606-615. doi:10.1109/TCPMT.2021.3059478 |
Stoukatch, S., Francis, L., Dupont, F., & Kraft, M. (March 2021). Low-cost microfluidic device micromachining and sequential integration with SAW sensor intended for biomedical applications. IEEE Sensors Journal, Volume 319. doi:10.1016/j.sna.2020.112526 |
Stoukatch, S., André, N., Delhaye, T., Dupont, F., Redouté, J.-M., & Flandre, D. (2020). Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB. Proceedings of IEEE Sensors, 1-4. doi:10.1109/SENSORS47125.2020.9278669 |
Dupont, F., Stoukatch, S., Laurent, P., & Redouté, J.-M. (2020). Fine pitch features laser direct patterning on flexible printed circuit board. Optics and Lasers in Engineering. doi:10.1016/j.optlaseng.2019.105869 |
Joris, L., Dupont, F., Laurent, P., Bellier, P., Stoukatch, S., & Redouté, J.-M. (2019). An Autonomous Sigfox Wireless Sensor Node for Environmental Monitoring. IEEE Sensors Letters, 3 (7), 1-4. doi:10.1109/LSENS.2019.2924058 |
Stoukatch, S., Dupont, F., & Kraft, M. (2018). Low-temperature Packaging Methods as a Key Enablers for Microsystems Assembly and Integration. International Semiconductor Conference. Proceedings. doi:10.1109/SMICND.2018.8539847 |
Stoukatch, S., Dupont, F., Seronveaux, L., Vandormael, D., & Kraft, M. (2018). Additive low temperature 3D printed electronic as enabling technology for IoT application. Electronics Packaging Technology Conference (EPTC). doi:10.1109/EPTC.2017.8277554 |
Bellier, P., Laurent, P., Stoukatch, S., Dupont, F., Joris, L., & Kraft, M. (2018). Autonomous micro-platform for multisensors with an advanced power management unit (PMU). Journal of Sensors and Sensor Systems, 7 (1), 299-308. doi:10.5194/jsss-7-299-2018 |
Dupont, F., Stoukatch, S., Laurent, P., Dricot, S., & Kraft, M. (January 2018). 355nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration. Optics and Lasers in Engineering, 100, 186-194. doi:10.1016/j.optlaseng.2017.08.014 |
Laurent, P., Stoukatch, S., Dupont, F., & Kraft, M. (2018). Electrical characterization of Aerosol Jet Printing (AJP) deposited conductive silver tracks on organic materials. Microelectronic Engineering, 197, 67-75. doi:10.1016/j.mee.2018.06.002 |
Colson, G., Laurent, P., Bellier, P., Stoukatch, S., Dupont, F., & Kraft, M. (10 May 2017). Smart-shoes self-powered by walking [Poster presentation]. Body sensor networks, Eindhoven, Netherlands. |
Laurent, P., Dupont, F., Stoukatch, S., & Axisa, F. (2015). Ultra-low power microsystems integrated. In 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems 2015. Mesago Messe Frankfurt GmbH. |